Cypress CY7C1415BV18 Referenced with Respect to, TDO for Jtag, TCK Pin for Jtag, TDI Pin for Jtag

Page 7

 

 

 

 

 

 

 

 

 

 

CY7C1411BV18, CY7C1426BV18

 

 

 

 

 

 

 

 

 

 

CY7C1413BV18, CY7C1415BV18

 

 

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

 

 

 

 

 

Pin Name

IO

 

 

 

 

 

Pin Description

 

CQ

Echo Clock

CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock

 

 

 

 

 

for output data (C) of the QDR-II. In the single clock mode, CQ is generated with respect to K. The timings

 

 

 

 

 

for the echo clocks are shown in the AC timing table.

 

 

 

 

Echo Clock

 

Referenced with Respect to

 

. This is a free running clock and is synchronized to the input clock

 

CQ

 

 

CQ

C

 

 

 

 

 

for output data (C) of the QDR-II. In the single clock mode, CQ is generated with respect to K. The timings

 

 

 

 

 

for the echo clocks are shown in the AC timing table.

 

ZQ

Input

Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus

 

 

 

 

 

impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected

 

 

 

 

 

between ZQ and ground. Alternatively, this pin can be connected directly to VDDQ, which enables the

 

 

 

 

 

minimum impedance mode. This pin cannot be connected directly to GND or left unconnected.

 

 

 

 

Input

DLL Turn Off Active LOW. Connecting this pin to ground turns off the DLL inside the device. The

 

DOFF

 

 

 

 

 

timings in the DLL turned off operation differs from those listed in this data sheet. For normal operation,

 

 

 

 

 

this pin can be connected to a pull up through a 10 KΩ or less pull up resistor. The device behaves in

 

 

 

 

 

QDR-I mode when the DLL is turned off. In this mode, the device can be operated at a frequency of up

 

 

 

 

 

to 167 MHz with QDR-I timing.

 

TDO

Output

TDO for JTAG.

 

 

 

 

 

TCK

Input

TCK Pin for JTAG.

 

 

 

 

 

TDI

Input

TDI Pin for JTAG.

 

 

 

 

 

TMS

Input

TMS Pin for JTAG.

 

 

 

 

 

NC

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

NC/72M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

NC/144M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

NC/288M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

VREF

Input-

Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs, and AC

 

 

 

 

Reference

measurement points.

 

VDD

Power Supply

Power Supply Inputs to the Core of the Device.

 

VSS

Ground

Ground for the Device.

 

VDDQ

Power Supply

Power Supply Inputs for the Outputs of the Device.

Document Number: 001-07037 Rev. *D

Page 7 of 30

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Contents Selection Guide FeaturesConfigurations Functional DescriptionLogic Block Diagram CY7C1426BV18 Logic Block Diagram CY7C1411BV18Doff Logic Block Diagram CY7C1415BV18 Logic Block Diagram CY7C1413BV18CY7C1426BV18 4M x Pin ConfigurationBall Fbga 15 x 17 x 1.4 mm Pinout CY7C1411BV18 4M xWPS BWS CY7C1413BV18 2M xCY7C1415BV18 1M x Pin Name Pin Description Pin DefinitionsTDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Referenced with Respect toFunctional Overview Echo Clocks Application ExampleDepth Expansion Programmable ImpedanceComments Truth TableWrite Cycle Descriptions OperationBWS0 Ieee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram TAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in QDR-II SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Parameter Description Test Conditions Fbga Unit CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitRPS, WPS Switching CharacteristicsHigh LOWDLL Timing Static to DLL ResetRead/Write/Deselect Sequence 29, 30 Switching WaveformsOrdering Information 250 167 Ball Fbga 15 x 17 x 1.4 mm Package DiagramWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal Information