Cypress CY7C1387F, CY7C1386F, CY7C1386D, CY7C1387D manual Ball Fbga 13 x 15 x 1.4 mm

Page 29

CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

Package Diagrams (continued)

Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)

15.00±0.10

15.00±0.10

TOP VIEW

 

 

 

 

 

 

 

TOP VIEW

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

1

2

3

4

5

6

7

8

9

10

11

 

 

A

 

1

 

2

3

4

5

6

7

8

9

10

11

B

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CB

DC

ED

FE

GF

HG

JH

KJ

15.00±0.10

 

 

 

 

 

 

 

 

 

BOTTOM VIEW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BOTTOM VIEWPIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.25 M C A B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.50

-0Ø0.06

.25 M C A B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(165X)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

-0.06

 

 

 

 

 

 

 

 

 

11

10

9

8

7

6

5

Ø0.50

(165X)

 

 

 

 

 

 

 

4

3

2

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

 

 

 

 

 

 

 

 

 

 

 

 

11

10

9

8

7

6

5

4

3

2

1A

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

1.00

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.00

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D

C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

E

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

F

E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

F

14.00

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

H

G

 

 

 

14.00

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

15.00±0.10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

H

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

K

J

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A

A

B

LK

ML

NM

PN

RP R

 

13.00±0.10

B

13.00±0.10

A

 

7.00

7.00

 

 

 

 

 

 

 

 

 

 

 

A

B

B

0.15(4X)

1.00

5.00

1.00

5.00

10.00

10.00

13.00±0.10

13.00±0.10

LK

ML

NM

PN

RP R

0.25 C

00.25.53±0C .05

0.53±0.05

 

0.36

C

 

0.36

1.40MAX.

 

 

 

 

 

0.15C MAX.

0.15 C

 

1.40

 

SEATING PLANE

SEATING PLANE

C

0.35±0.06

0.35±0.06

0.15(4X)

NOTES :

SOLDERNOTESPAD TYPE: : NON-SOLDER MASK DEFINED (NSMD)

PACKAGESOLDWEIGHTR PAD: 0TYPE.475g: NON-SOLDER MASK DEFINED (NSMD)

JEDEC REFERENCEPACKAGE WEIGHT: MO-216: 0./475gDESIGN 4.6C

PACKAGEJEDECCODEREFERENCE: BB0AC : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

51-85180-*A

Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. PowerPC is a trademark of IBM Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.

Document Number: 38-05545 Rev. *E

Page 29 of 30

© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Image 29
Contents Selection Guide Features250 MHz 200 MHz 167 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1387D/CY7C1387F 3 1M x Logic Block Diagram CY7C1386D/CY7C1386F 3 512K xCY7C1387D 1M x Pin Configurations Pin Tqfp Pinout 3 Chip EnablesCY7C1386D 512K X Pin Configurations Ball BGA Pinout 1 Chip Enable Pin Configurations Ball Fbga Pinout 3 Chip Enable Pin Definitions Power supply inputs to the core of the deviceName Description Byte write select inputs, active LOW. Qualified withFunctional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Operation Add. Used Function CY7C1387D/CY7C1387F Truth Table for Read/Write 6Function CY7C1386D/CY7C1386F TAP Controller Block Diagram TAP Controller State DiagramTAP Instruction Set Bypass RegisterTAP Timing TAP AC Switching Characteristics5V TAP AC Test Conditions 3V TAP AC Test Conditions3V TAP AC Output Load Equivalent GND VIN VddqScan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeInternal Ball BGA Boundary Scan Order 14Bit # Ball ID M11 A10 B10M10 G10 F10 InternalMaximum Ratings Electrical CharacteristicsOperating Range Range AmbientAC Test Loads and Waveforms CapacitanceThermal Resistance Description 250 200 167 Unit Parameter Min Switching Characteristics Over the Operating Range 20Read Cycle Timing Switching WaveformsAdsc Write Cycle Timing 26Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document Number Issue Date Orig. Description of ChangeDocument History