Cypress CY7C1387F, CY7C1386F, CY7C1386D manual Features, Selection Guide, MHz 200 MHz 167 MHz Unit

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CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM

Features

Functional Description [1]

Supports bus operation up to 250 MHz

Available speed grades are 250, 200, and 167 MHz

Registered inputs and outputs for pipelined operation

Optimal for performance (double-cycle deselect)

Depth expansion without wait state

3.3V core power supply (VDD)

2.5V or 3.3V IO power supply (VDDQ)

Fast clock-to-output times

— 2.6 ns (for 250 MHz device)

Provides high-performance 3-1-1-1 access rate

User selectable burst counter supporting IntelPentiuminterleaved or linear burst sequences

Separate processor and controller address strobes

Synchronous self timed writes

Asynchronous output enable

CY7C1386D/CY7C1387D available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA package. CY7C1386F/CY7C1387F available in Pb-free and non Pb-free 119-ball BGA package

IEEE 1149.1 JTAG-Compatible Boundary Scan

ZZ sleep mode option

Selection Guide

The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F SRAM integrates 512K x 36/1M x 18 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive edge triggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining chip enable (CE1), depth expansion chip enables (CE2 and CE3 [2]), burst control inputs (ADSC, ADSP, and ADV), write enables (BWX, and BWE), and global write (GW). Asynchronous inputs include the output enable (OE) and the ZZ pin.

Addresses and chip enables are registered at rising edge of clock when either address strobe processor (ADSP) or address strobe controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the advance pin (ADV).

Address, data inputs, and write controls are registered on-chip to initiate a self timed write cycle.This part supports byte write operations (see Pin Configurations on page 3 and Truth Table [4, 5, 6, 7, 8] on page 9 for further details). Write cycles can be one to four bytes wide as controlled by the byte write control inputs. GW active LOW causes all bytes to be written. This device incorporates an additional pipelined enable register which delays turning off the output buffers an additional cycle when a deselect is executed.This feature allows depth expansion without penalizing system performance.

The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F operates from a +3.3V core power supply while all outputs operate with a +3.3V or +2.5V supply. All inputs and outputs are JEDEC-standard and JESD8-5-compatible.

 

250 MHz

200 MHz

167 MHz

Unit

Maximum Access Time

2.6

3.0

3.4

ns

 

 

 

 

 

Maximum Operating Current

350

300

275

mA

 

 

 

 

 

Maximum CMOS Standby Current

70

70

70

mA

 

 

 

 

 

Notes

1.For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.

2.CE3 and CE2 are for TQFP and 165 FBGA packages only. 119 BGA is offered only in Single Chip Enable.

Cypress Semiconductor Corporation

198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document Number: 38-05545 Rev. *E

 

Revised Feburary 09, 2007

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Contents Selection Guide Features250 MHz 200 MHz 167 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1387D/CY7C1387F 3 1M x Logic Block Diagram CY7C1386D/CY7C1386F 3 512K xCY7C1386D 512K X Pin Configurations Pin Tqfp Pinout 3 Chip EnablesCY7C1387D 1M x Pin Configurations Ball BGA Pinout 1 Chip Enable Pin Configurations Ball Fbga Pinout 3 Chip Enable Pin Definitions Power supply inputs to the core of the deviceName Description Byte write select inputs, active LOW. Qualified withFunctional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Operation Add. Used Function CY7C1386D/CY7C1386F Truth Table for Read/Write 6Function CY7C1387D/CY7C1387F TAP Controller Block Diagram TAP Controller State DiagramTAP Instruction Set Bypass RegisterTAP Timing TAP AC Switching Characteristics5V TAP AC Test Conditions 3V TAP AC Test Conditions3V TAP AC Output Load Equivalent GND VIN VddqScan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeBit # Ball ID Ball BGA Boundary Scan Order 14Internal M11 A10 B10M10 G10 F10 InternalMaximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Description 250 200 167 Unit Parameter Min Switching Characteristics Over the Operating Range 20Read Cycle Timing Switching WaveformsAdsc Write Cycle Timing 26Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document History Issue Date Orig. Description of ChangeDocument Number