Cypress CY7C1387D, CY7C1386F, CY7C1387F, CY7C1386D manual Functional Overview

Page 7

 

 

 

 

CY7C1386D, CY7C1386F

 

 

 

 

CY7C1387D, CY7C1387F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

Name

 

IO

Description

 

 

 

VSS

Ground

Ground for the core of the device.

VSSQ

IO Ground

Ground for the IO circuitry.

VDDQ

IO Power Supply

Power supply for the IO circuitry.

MODE

Input-

Selects burst order. When tied to GND selects linear burst sequence. When tied

 

Static

to VDD or left floating selects interleaved burst sequence. This is a strap pin and

 

 

 

 

must remain static during device operation. Mode pin has an internal pull up.

 

 

 

TDO

JTAG serial output

Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If

 

Synchronous

the JTAG feature is not used, this pin must be disconnected. This pin is not available

 

 

 

 

on TQFP packages.

 

 

 

TDI

JTAG serial

Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG

 

input

feature is not used, this pin can be disconnected or connected to VDD. This pin is

 

Synchronous

not available on TQFP packages.

 

 

 

TMS

JTAG serial

Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG

 

input

feature is not used, this pin can be disconnected or connected to VDD. This pin is

 

Synchronous

not available on TQFP packages.

 

 

 

TCK

JTAG-

Clock input to the JTAG circuitry. If the JTAG feature is not used, this pin must

 

Clock

be connected to VSS. This pin is not available on TQFP packages.

NC

 

 

No Connects. Not internally connected to the die

 

 

 

 

 

NC/(36M, 72M,

 

 

These pins are not connected. They will be used for expansion to the 36M, 72M,

144M, 288M,

 

 

 

144M, 288M, 576M, and 1G densities.

576M, 1G)

 

 

 

 

 

 

 

 

 

Functional Overview

All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock.

The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F supports secondary cache in systems using either a linear or interleaved burst sequence. The interleaved burst order supports Pentium® and i486processors. The linear burst sequence is suited for processors that use a linear burst sequence. The burst order is user selectable, and is determined by sampling the MODE input. Accesses can be initiated with either the processor address strobe (ADSP) or the controller address strobe (ADSC). Address advancement through the burst sequence is controlled by the ADV input. A two-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access.

Byte write operations are qualified with the byte write enable (BWE) and byte write select (BWX) inputs. A global write enable (GW) overrides all byte write inputs and writes data to all four bytes. All writes are simplified with on-chip synchronous self timed write circuitry.

Synchronous chip selects CE1, CE2, CE3 [2] and an asynchronous output enable (OE) provide for easy bank selection and output tri-state control. ADSP is ignored if CE1 is HIGH.

Single Read Accesses

This access is initiated when the following conditions are satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2) chip selects are all asserted active, and (3) the write signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if CE1 is HIGH. The address presented to the address inputs is stored into the address advancement logic and the address register while being presented to the memory core. The corresponding data is allowed to propagate to the input of the output registers. At the rising edge of the next clock the data is allowed to propagate through the output register and onto the data bus within tCO if OE is active LOW. The only exception occurs when the SRAM is emerging from a deselected state to a selected state, its outputs are always tri-stated during the first cycle of the access. After the first cycle of the access, the outputs are controlled by the OE signal. Consecutive single read cycles are supported.

The CY7C1386D/CY7C1387D/CY7C1386F/CY7C1387F is a double cycle deselect part. Once the SRAM is deselected at clock rise by the chip select and either ADSP or ADSC signals, its output will tri-state immediately after the next clock rise.

Single Write Accesses Initiated by ADSP

This access is initiated when both of the following conditions are satisfied at clock rise: (1) ADSP is asserted LOW, and (2) chip select is asserted active. The address presented is loaded into the address register and the address advancement logic while being delivered to the memory core.

Document Number: 38-05545 Rev. *E

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Contents Cypress Semiconductor Corporation FeaturesSelection Guide 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1387D/CY7C1387F 3 1M x Logic Block Diagram CY7C1386D/CY7C1386F 3 512K xCY7C1386D 512K X Pin Configurations Pin Tqfp Pinout 3 Chip EnablesCY7C1387D 1M x Pin Configurations Ball BGA Pinout 1 Chip Enable Pin Configurations Ball Fbga Pinout 3 Chip Enable Byte write select inputs, active LOW. Qualified with Power supply inputs to the core of the devicePin Definitions Name DescriptionFunctional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Operation Add. Used Function CY7C1386D/CY7C1386F Truth Table for Read/Write 6Function CY7C1387D/CY7C1387F TAP Controller Block Diagram TAP Controller State DiagramTAP Instruction Set Bypass RegisterTAP Timing TAP AC Switching CharacteristicsGND VIN Vddq 3V TAP AC Test Conditions5V TAP AC Test Conditions 3V TAP AC Output Load EquivalentRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Identification CodesBit # Ball ID Ball BGA Boundary Scan Order 14Internal G10 F10 Internal A10 B10M11 M10Range Ambient Electrical CharacteristicsMaximum Ratings Operating RangeThermal Resistance CapacitanceAC Test Loads and Waveforms Description 250 200 167 Unit Parameter Min Switching Characteristics Over the Operating Range 20Read Cycle Timing Switching WaveformsAdsc Write Cycle Timing 26Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document History Issue Date Orig. Description of ChangeDocument Number