Cypress CY7C1386F, CY7C1387F, CY7C1386D manual Switching Characteristics Over the Operating Range 20

Page 20

CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

Switching Characteristics Over the Operating Range [20, 21]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Description

–250

 

–200

–167

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min

Max

Min

 

Max

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tPOWER

 

VDD(Typical) to the First Access [22]

1

 

1

 

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

5.0

 

 

6.0

 

ns

tCH

 

Clock HIGH

1.7

 

2.0

 

 

2.2

 

ns

tCL

 

Clock LOW

1.7

 

2.0

 

 

2.2

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid after CLK Rise

 

2.6

 

 

3.0

 

3.4

ns

tDOH

 

Data Output Hold after CLK Rise

1.0

 

1.3

 

 

1.3

 

ns

tCLZ

 

Clock to Low-Z [23, 24, 25]

1.0

 

1.3

 

 

1.3

 

ns

tCHZ

 

Clock to High-Z [23, 24, 25]

 

2.6

 

 

3.0

 

3.4

ns

tOEV

 

 

 

LOW to Output Valid

 

2.6

 

 

3.0

 

3.4

ns

OE

 

 

 

tOELZ

 

 

 

LOW to Output Low-Z [23, 24, 25]

0

 

0

 

 

0

 

ns

OE

 

 

 

 

tOEHZ

 

 

 

HIGH to Output High-Z [23, 24, 25]

 

2.6

 

 

3.0

 

3.4

ns

OE

 

 

 

Set-up Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Set-up Before CLK Rise

1.2

 

1.4

 

 

1.5

 

ns

tADS

 

 

 

 

 

 

 

 

 

 

 

 

 

Set-up Before CLK Rise

1.2

 

1.4

 

 

1.5

 

ns

ADSC,

ADSP

 

 

 

 

tADVS

 

 

 

 

 

Set-up Before CLK Rise

1.2

 

1.4

 

 

1.5

 

ns

ADV

 

 

 

 

tWES

 

 

 

 

 

 

 

 

 

 

 

 

 

X Set-up Before CLK Rise

1.2

 

1.4

 

 

1.5

 

ns

GW,

BWE,

BW

 

 

 

 

tDS

 

Data Input Set-up Before CLK Rise

1.2

 

1.4

 

 

1.5

 

ns

tCES

 

Chip Enable Set-Up Before CLK Rise

1.2

 

1.4

 

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.3

 

0.4

 

 

0.5

 

ns

tADH

 

 

 

 

 

 

 

 

 

 

 

Hold After CLK Rise

0.3

 

0.4

 

 

0.5

 

ns

ADSP,

ADSC

 

 

 

 

tADVH

 

 

 

 

Hold After CLK Rise

0.3

 

0.4

 

 

0.5

 

ns

ADV

 

 

 

 

tWEH

 

 

 

 

 

 

 

 

 

 

 

 

 

X Hold After CLK Rise

0.3

 

0.4

 

 

0.5

 

ns

GW,

BWE,

BW

 

 

 

 

tDH

 

Data Input Hold After CLK Rise

0.3

 

0.4

 

 

0.5

 

ns

tCEH

 

Chip Enable Hold After CLK Rise

0.3

 

0.4

 

 

0.5

 

ns

Notes

20.Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.

21.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

22.This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can be initiated.

23.tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

24.At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions.

25.This parameter is sampled and not 100% tested.

Document Number: 38-05545 Rev. *E

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Contents Features Selection Guide250 MHz 200 MHz 167 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1386D/CY7C1386F 3 512K x Logic Block Diagram CY7C1387D/CY7C1387F 3 1M xCY7C1387D 1M x Pin Configurations Pin Tqfp Pinout 3 Chip EnablesCY7C1386D 512K X Pin Configurations Ball BGA Pinout 1 Chip Enable Pin Configurations Ball Fbga Pinout 3 Chip Enable Power supply inputs to the core of the device Pin DefinitionsName Description Byte write select inputs, active LOW. Qualified withFunctional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Operation Add. Used Function CY7C1387D/CY7C1387F Truth Table for Read/Write 6Function CY7C1386D/CY7C1386F TAP Controller State Diagram TAP Controller Block DiagramBypass Register TAP Instruction SetTAP AC Switching Characteristics TAP Timing3V TAP AC Test Conditions 5V TAP AC Test Conditions3V TAP AC Output Load Equivalent GND VIN VddqIdentification Register Definitions Scan Register SizesIdentification Codes Register Name Bit SizeInternal Ball BGA Boundary Scan Order 14Bit # Ball ID A10 B10 M11M10 G10 F10 InternalElectrical Characteristics Maximum RatingsOperating Range Range AmbientAC Test Loads and Waveforms CapacitanceThermal Resistance Switching Characteristics Over the Operating Range 20 Description 250 200 167 Unit Parameter MinSwitching Waveforms Read Cycle TimingWrite Cycle Timing 26 AdscRead/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information CY7C1386D, CY7C1386F CY7C1387D, CY7C1387F Package Diagrams Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document Number Issue Date Orig. Description of ChangeDocument History