Cypress CY62157EV30 manual Features, Functional Description1, Logic Block Diagram

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CY62157EV30 MoBL®

8-Mbit (512K x 16) Static RAM

Features

TSOP I package configurable as 512K x 16 or as 1M x 8

SRAM

High speed: 45 ns

Wide voltage range: 2.20V–3.60V

Pin compatible with CY62157DV30

Ultra low standby power

Typical Standby current: 2 A

Maximum Standby current: 8 A (Industrial)

Ultra low active power

Typical active current: 1.8 mA @ f = 1 MHz

Easy memory expansion with CE1, CE2, and OE features

Automatic power down when deselected

CMOS for optimum speed and power

Available in both Pb-free and non Pb-free 48-ball VFBGA, Pb-free 44-pin TSOP II and 48-pin TSOP I packages

Functional Description[1]

The CY62157EV30 is a high performance CMOS static RAM organized as 512K words by 16 bits. This device features advanced circuit design to provide ultra low active current. This is ideal for providing More Battery Life(MoBL®) in portable applications such as cellular telephones. The device also has an automatic power down feature that significantly

reduces power consumption when addresses are not toggling. Place the device into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input or output pins (IO0 through IO15) are placed in a high impedance state when:

Deselected (CE1HIGH or CE2 LOW)

Outputs are disabled (OE HIGH)

Both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH)

Write operation is active (CE1 LOW, CE2 HIGH and WE LOW)

To write to the device, take Chip Enable (CE1 LOW and CE2 HIGH) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from IO pins (IO0 through IO7) is written into the location specified on the address pins (A0 through A18). If Byte High Enable (BHE) is LOW, then data from IO pins (IO8 through IO15) is written into the location specified on the address pins (A0 through A18).

To read from the device, take Chip Enable (CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appear on IO0 to IO7. If Byte High Enable (BHE) is LOW, then data from memory appears on IO8 to IO15. See the “Truth Table” on page 10 for a complete description of read and write modes.

Logic Block Diagram

 

 

DATA IN DRIVERS

 

 

 

 

A10

 

 

 

 

 

 

 

 

 

 

A 9

ROWDECODER

 

 

 

 

 

SENSE AMPS

 

 

 

A 8

 

 

 

 

 

 

 

 

A 7

512K × 16 / 1M x 8

 

 

 

A 6

 

 

 

A 5

 

RAM Array

IO

–IO

7

A 4

 

 

 

 

 

0

 

A 3

 

 

 

 

 

IO8–IO15

A 2

 

 

 

 

 

 

 

 

 

 

A 1

 

 

 

 

 

 

 

 

 

 

A 0

 

 

 

 

 

 

 

 

 

 

 

 

COLUMN DECODER

 

 

 

 

 

CE2

 

 

 

 

 

 

BYTE

 

Power Down

CE1

 

 

 

 

 

 

BHE

 

11

12

13

14

15 16 17 18

 

WE

CE2

Circuit

 

 

 

 

CE1

BHE

A A A A A A A A

 

OE

 

 

 

 

 

BLE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BLE

 

 

 

 

 

 

 

 

 

 

Notes

 

 

 

 

 

 

 

 

 

 

1. For best practice recommendations, please refer to the Cypress application note AN1064, SRAM System Guidelines.

Cypress Semiconductor Corporation

• 198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document #: 38-05445 Rev. *E

 

Revised May 07, 2007

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Contents Logic Block Diagram FeaturesFunctional Description1 Cypress Semiconductor CorporationProduct Portfolio Pin ConfigurationBall Vfbga Top View Following picture shows the 48-ball Vfbga pinout.3, 4Maximum Ratings Electrical CharacteristicsOperating Range CapacitanceThermal Resistance Data Retention CharacteristicsAC Test Loads and Waveforms Data Retention Waveform12Write Cycle Switching CharacteristicsRead Cycle No Address Transition Controlled19 Switching WaveformsWrite Cycle No CE1 or CE2 Controlled18, 22 Write Cycle No WE Controlled18, 22Write Cycle No BHE/BLE Controlled, OE LOW23 Write Cycle No WE Controlled, OE LOW23Truth Table Inputs/Outputs Mode PowerOrdering Information BHE BLEPin Vfbga 6 x 8 x 1 mm Package DiagramsPin Tsop II Pin Tsop I 12 mm x 18.4 mm x 1.0 mm Document History Issue Date Orig. Change Description of ChangeDocument Number REV ECN no