CY7C1302DV25
Document #: 38-05625 Rev. *A Page 17 of 18
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsib ility f or the u seof any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to beused for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize itsproducts for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypressproducts in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.Quad Data Rate SRAM and QDR SRAM comprise a new family of products developed by Cypress, IDT, NEC, Renesas and
Samsung. All product and company names mentioned in this document are trademarks of their respective holders.
Ordering Information“Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered”.
Speed
(MHz) Ordering Code Package
Diagram Package Type Operating
Range
167 CY7C1302DV25-167BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial
CY7C1302DV25-167BZXC 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free
CY7C1302DV25-167BZI 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial
CY7C1302DV25-167BZXI 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free
Package DiagramA
1
PIN1CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25MCAB
Ø0.05MC
B
A
0.15(4X)
0.35±0.06
SEATINGPLANE
0.53±0.05
0.25C
0.15C
PIN1CORNER
TOPVIEW
BOTTOMVIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40MAX.SOLDERPAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES:
PACKAGEWEIGHT : 0.475g
JEDECREFERENCE : MO-216 / DESIGN 4.6C
PACKAGECODE : BB0AC
51-85180-*A165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
A
1
PIN 1 CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.35±0.06
SEATING PLANE
0.53±0.05
0.25 C
0.15 C
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40 MAX.