Temperature/Humidity
You must maintain a proper temperature and humidity in the equipment room.
For the temperature and humidity requirements of different models, refer to Table
Cleanness
Dust is a hazard to the operating safety of your device. The dust accumulated on the chassis can be adsorbed by static electricity and result in poor contact of metal connectors or metal contact points. Especially when the indoor relative humidity is low, electrostatic adsorption is more likely to happen. This can not only shorten the service life of your device but also cause communications failures. The following table lists the dust concentration limit.
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Dust |
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| ≤ 3 x 104 | (no visible dust on the tabletop |
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Note: The dust particle size ≥ 5 μm.
Besides dust, there are rigorous limits on the content of harmful substances in the air that can accelerate the corrosion and aging of metals, such as chloride, acid, and sulfide in the equipment room, and the equipment room must be protected against ingression of harmful gases such as SO2, H2S, NH3, and Cl2. For specific requirements, see the following table.
Table
Gas | Maximum concentration (mg/m3) |
SO2 | 0.2 |
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H2S | 0.006 |
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NH3 | 0.05 |
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Cl2 | 0.01 |
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Electromagnetic Susceptibility
The operation of your switch can be affected by external interferences, such as conducted emission by capacitance coupling, inductance coupling, electromagnetic wave radiation, and common impedance (including the grounding system) coupling, and leads (power cords, signaling cables and output wires). To eliminate the interferences, pay attention to the following:
zAs the AC power system is a TN system, use a