TOC
TOC
ELECTRICAL DIAGRAMS | ||
PC BOARD ASSEMBLY - BOOST - |
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| ENGINEERING CONTROLLED CHANGE DETAIL: REVISED ITEM 4 WASHER | |
MANUFACTURER: | No |
NOTES:
N.A. CAUTION: THIS DEVICE IS SUBJECT TO DAMAGE BY STATIC ELECTRICITY.
SEE E2454 BEFORE HANDLING.
N.B. MODULE IDENTIFICATION LABEL TO BE PLACED IN THIS AREA.
N.C. MOLEX CAVITES AND AREA AROUND LOCKING TAB TO BE FREE OF POTTING MATERIAL. MASK PER
R19
ITEM | REQ'D | PART NO. | DESCRIPTION |
C1,C11 | 2 | CAPACITOR,PEMF,1.0,63V,10% | |
C3,C7,C14,C28 | 4 | CAPACITOR,CEMO,0.1, 50V,10% | |
C4 | 1 | CAPACITOR,CEMO,47P, 100V,5% | |
C5,C6 | 2 | CAPACITOR,CEMO,4700P, 50V,2% | |
C8,C12 | 2 | ||
C9,C10 | 2 | CAPACITOR,ALEL,1200,160V,20% | |
C21,C26,C29 | 3 | CAPACITOR,CEMO,.022,50V,20% | |
C24 | 1 | ||
D1 | 1 | DIODE,SCHOTTKY,AXLDS,1A,30V,1N5818 | |
D2,D6,D7,D8,D9 | 5 | DIODE,AXLDS,1A,400V,FR,1N4936 |
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APPROPRIATE MANUFACTURING WORK INSTRUCTIONS.
N.D. TORQUE TO 3.0 in. lbs.
N.E. ENCAPSULATE TO WITHIN .10 OF TRAY TOP. WHILE APPLYING ENCAPSULATION, APPLY SOME OVER THE TOP OF ITEM 11.
N.F. PRINT
N.G. ASSEMBLE ITEMS 1 THROUGH ITEMS 4 AS SHOWN. TORQUE MODULE TO
N.H. ASSEMBLE P.C. BOARD WITH CAPACITORS LOCATED AS SHOWN.
P.C. BOARD BLANK INFORMATION
BUY COMPLETE AS
(MAKES 8 BOARDS PER PANEL. SEE ELECTRONIC FILE FOR ADDITIONAL INFORMATION)
PANEL SIZE PER E1911
N.C.
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R5 |
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| J47 |
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| TP1 |
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| FTP6 |
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| DZ2 | R8 |
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| C3 |
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| FTP4 | X1 | |
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| D1 | R6 | R7 | C4 | C5 |
R10 | R11 | R12 | D6 | R61 |
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| C6 | ||||||
| R75 |
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| C8 |
| FTP7 |
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| R73 |
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| R74 |
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| DZ6 |
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R51 | R60 | DZ8 |
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| C12 |
| C24 |
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Q6 |
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| R21 |
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Q1
+ | - |
C9
C1
R2R1
R9 | C7 | DZ1 | R20 | D9 | C29 R69 R64 R63 |
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| X2 |
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| R70 | R68 | C14 |
FTP8
BOOST SUPPLY
M19753-
2
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| C10 |
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| R71 |
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| R72 | R18 | |
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| TP2 |
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| C11 | R17 | |
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| A1 |
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| DZ9 |
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C28 | R62 | C26FTP5 | D8 |
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| R16 |
| D7 | R52 | R67 | R66 | R65 |
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| R15 |
R40 | C21 | R39 | R55 | Q7 |
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| R14 |
| DZ7 | R37 | R38 | Q5 |
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| DZ1 | 1 | ZENER DIODE,5W,16V,5% 1N5353B | |
| DZ2,DZ9 | 2 | ZENER DIODE, 1W,18V,5% 1N4746A | |
| DZ6,DZ8 | 2 | ZENER DIODE, 1W,15V,5% 1N4744A | |
| DZ7 | 1 | ZENER DIODE, 1W,10V,5% 1N4740A | |
| FTP4,FTP5,FTP6,FTP7,FTP8 | 5 | TESTPT_FUNTION | FUNCTIONAL TEST POINT |
| J47 | 1 | ||
| L1 | 1 | CHOKE,470UH,10%,11.4A,RADIAL | |
N.A. Q1 | 1 | MOSFET/HEATSINK | ||
| Q5,Q6,Q7 | 3 | TRANSISTOR,NPN,TO226,0.5A,40V,2N4401 | |
| R1,R2,R71,R72 | 4 |
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| R5,R10 | 2 | RESISTOR,MF,1/4W,10.0K,1% | |
| R6 | 1 | RESISTOR,MF,1/4W,90.9K,1% | |
| R7,R52 | 2 | RESISTOR,MF,1/4W,1.82K,1% | |
| R8 | 1 | RESISTOR,MF,1/4W,20.0,1% | |
| R9,R20 | 2 | RESISTOR,MF,1/4W,267K,1% | |
| R11 | 1 | RESISTOR,MF,1/4W,4.32K,1% | |
| R12 | 1 | RESISTOR,MF,1/4W,221K,1% | |
| R14,R15,R16 | 3 |
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| R17,R18,R19 | 3 | RESISTOR,MF,1/4W,8.25K,1% | |
| R21 | 1 | RESISTOR,MF,1/4W,56.2K,1% | |
| R37,R38 | 2 | RESISTOR,MF,1/4W,33.2K,1% | |
| R39,R40,R64,R65,R66,R67 | 6 | RESISTOR,MF,1/4W,100K,1% | |
| R51 | 1 | RESISTOR,MF,1/4W,100,1% | |
| R55 | 1 | RESISTOR,MF,1/4W,150K,1% | |
| R60 | 1 | RESISTOR,MF,1/4W,3.32K,1% | |
| R61,R73,R74,R75 | 4 | RESISTOR,MF,1/4W,47.5,1% | |
| R62 | 1 | RESISTOR,MF,1/4W,681,1% | |
| R63 | 1 | RESISTOR,MF,1/4W,2.21K,1% |
N.G.
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| N.B. |
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6 | 12 | 5 |
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N.F.
N.H.
8
4
7
N.D.
N.G.
4
10 11
R68 | 1 | RESISTOR,MF,1/4W,1.00M,1% | |
R69 | 1 | RESISTOR,MF,1/4W,7.50K,1% | |
R70 | 1 | RESISTOR,MF,1/4W,475K,1% | |
TP1,TP2 | 2 | MOV,175VRMS,120J,20MM | |
X1 | 1 | ||
X2 | 1 |
ISO VIEW
REFERENCE ONLY
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| ITEM | PART NO. | DESCRIPTION | QTY |
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| 1 | M19996 | HEAT SINK |
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| 2 | THERMAL INTERFACE PAD | 1 |
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IDENTIFICATION CODE |
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| N.A. | 3 | ELECTRONIC MODULE ASBLY | 1 |
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| CF000012 | 2 |
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| 4 | SPRING WASHER | 2 |
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| CF000017 |
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MAKE PER E1911& E3875 |
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| 5 | GASKET |
| 1 |
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| 6 | POTTING TRAY | 1 |
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TEST PER |
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| 7 | SELF TAPPING SCREW | 2 |
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ENCAPSULATE WITH ITEM 9 |
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| 8 | SEE ABOVE | BOOST PC BD BLANK | 1 |
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| * | 9 | E2527 | EPOXY ENCAPSULATING RESIN |
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| 10 | HEAT SINK |
| 1 |
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SCHEMATIC REFERENCE: |
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| 11 | HEAT SINK MOUNTING CLIP | 1 |
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| N.B., N.F. | 12 | LABEL |
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| * THESE ITEMS NOT SHOWN |
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| THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION OWNED BY LINCOLN GLOBAL, INC. AND MAY NOT BE DUPLICATED, COMMUNICATED |
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| PROPRIETARY & CONFIDENTIAL: |
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| TO OTHER PARTIES OR USED FOR ANY PURPOSE WITHOUT THE EXPRESS WRITTEN PERMISSION OF LINCOLN GLOBAL, INC. |
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| ON 2 PLACE DECIMALS IS ± .02 |
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| PAGE 1 | OF 1 | EDGE | ||
| UNLESS OTHERWISE SPECIFIED TOLERANCE | DESIGN INFORMATION | REFERENCE: | EQUIPMENT TYPE: |
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| MANUFACTURING TOLERANCE PER E2056 |
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| ON 3 PLACE DECIMALS IS ± .002 | DRAWN BY: FEI |
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| SUBJECT: |
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| BOOST BD HEATSINK ASBLY |
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| DOCUMENT |
| DOCUMENT | SOLID | |||||||||
| ON ALL ANGLES IS ± .5 OF A DEGREE | ENGINEER: | SCALE: |
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| NUMBER: |
| REVISION: | ||||||||
| MATERIAL TOLERANCE ("t ") TO AGREE |
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| DO NOT SCALE THIS DRAWING | APPROVED: | 1:1 |
| DISPOSITION: UF | DATE: |
| 05/12/2003 | NUMBER: |
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| WITH PUBLISHED STANDARDS. |
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| MATERIAL |
| APPROVAL |
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STRP
NOTE: Lincoln Electric assumes no responsibility for liablilities resulting from board level troubleshooting. PC Board repairs will invalidate your factory warranty. Individual Printed Circuit Board Components are not available from Lincoln Electric. This information is pro- vided for reference only. Lincoln Electric discourages board level troubleshooting and repair since it may compromise the quality of the design and may result in danger to the Machine Operator or Technician. Improper PC board repairs could result in damage to the machine.