For CX4 (copper interface) applications an external module is required to connect the four transmit lanes to the four corresponding receive lanes. This module must contain all of the associated handshake signals required to redirect the four transmit lanes to the four receive lanes.
For XFP (10 Gigabit small form factor pluggable module) applications, an 850 nm
Link. Reports the status of the link as up or down.
LED. Interactive test that causes the LEDs to blink. The software/driver has no
All Tests. Runs all of the diagnostic tests described in this section by using the single command.
HP NC-Series Broadcom Multifunction adapter diagnostics
1.Boot to DOS or the EFI shell.
2.From the DOS prompt navigate to the \APPS\DIAGS\MFDIAG directory.
3.Type XDIAG and press the Enter key. The diagnostic tests run automatically.
About the XDIAG.exe diagnostic tests
The xdiag.exe diagnostic tests are divided into four groups: Group A: Register tests; Group B: Memory
tests; Group C: Block tests; an Group D: Miscellaneous tests.
Group A: Register tests
•A1. Register test
This tests the chip registers, accessible through
•A2. PCI configuration test
This test checks the functionality of the BAR size configuration by examining the BAR value as the BAR size varies.
•A3. Interrupt test
This test checks to see if the system (OS) receives the interrupt artificially generated by the chip and if the software ISR is properly invoked.
•A4.
Not used
•A5. MSI test
This test checks for the correct behavior of the MSI, making sure no interrupt is generated other than the message. It also runs the negative test to make sure no message is generated when interrupt is masked off.
•A6. Memory BIST
This tests all memory modules inside the chip using
•A7. Network link test
Diagnostics 53