•C6. NVM access and
This tests the
•C7.
This test issues multiple chip resets and constant driver load/unload to check for boot ROM appropriately loads the bootcode. This test requires a proper bootcode to be programmed into the
•C8. DMA engine test
This tests the internal DMA engine by performing both DMA reads and writes at various location and various sizes. CRC check is performed to ensure data integrity. DMA write test also checks to ensure that the DMA writes do not corrupt the neighboring host memory. This test requires the presence of test firmware files inside the “diagfw” directory.
•C9. VPD test
This tests the VPD interface used by the bootcode. This test requires a proper bootcode to be programmed into the
•C10. Not used
•C11. FIO Events test
This test checks for the event bits in the CPU’s Fast IO interface, making sure appropriate bits are triggered when a particular event occurs (GPIO bit changes, NVM access, and so on).
Group D: Miscellaneous tests
•D1. MAC loopback test
This test puts the chip in the MAC loopback mode and transmits 5000 layer two packets of various sizes and receives them and checks the packet integrity.
•D2. PHY loopback test
This test puts the chip in the PHY loopback mode and transmits 5000 layer two packets of various sizes and receives them and checks the packet integrity.
•D3. External loopback test
This test puts the chip in the PHY loopback mode and transmits various number of layer two packets of various sizes and receives them and checks the packet integrity. The number of packets is determined by the speed. For
•D4. LSO test
This test checks the functionality of the large send offload by submit big TCP packets to the chip and expects the chip to segment them into multiple smaller TCP packets (based on the MSS). The packets are returned in the MAC loopback mode and their integrity is checked upon receive.
•D5. EMAC statistics test
This test checks the basic statistics information maintained by the chip by sending and receiving packets of various sizes.