ADCP-75-210 • Issue 1 • March 2007

4 NON-STANDARD INSTALLATION PROCEDURES

This section contains other installation procedures that are not typically done at a RAN installation. These procedures cover field installation of electronic modules and other components like the RAN chassis fans.

4.1Installing an Electronic Module

If installing an electronic module in the field, refer to the appropriate procedure in this section. There is a procedure for each type of electronic module. For a comprehensive description of the electronic modules including function, controls, and indicators, refer to the appropriate topic in Section 1.7 on Page 10.

Typically, the RAN chassis is shipped populated with the appropriate modules based on the pre- ordered system configuration. Installation of electronic modules is only required when installing a new electronic module or when changing the the system configuration.

Note: Not all options and features are supported in combination.

The electronic modules install into predetermined slots in the chassis identified by the labels on the fan access panel above the chassis. For an illustration of the fan access panel labels and a listing of the slots, refer to Section 1.7 on Page 10.

Warning: Electronic components can be damaged by static electrical discharge. To prevent ESD damage, always wear an ESD wrist strap when handling electronic components.

The interconnection diagram shown in Figure 40 and Figure 41 on the next two pages summarizes the interconnections between the RAN chassis electronic modules and other electronic components of the RAN such as rectifiers and PAAs.

Note: The interconnection diagram shows a typical configuration. Other configurations are possible that would be interconnected slightly differently.

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© 2007, ADC Telecommunications, Inc.