Cypress CY7C1347G manual Package Diagrams continued, 165-Ball FBGA 13 x 15 x 1.4 mm, Page 20 of

CY7C1347G

Package Diagrams (continued)

Figure 11. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180

15.00±0.10

A

TOP VIEW

PIN 1 CORNER

1 2 3 4 5 6 7 8 9 10 11

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

15.00±0.10

A

BOTTOM VIEW

							PIN 1 CORNER
					Ø0.05 M C
						Ø0.25 M C A B
					Ø0.50		-0.06	(165X)
							+0.14
11	10	9	8	7	6	5	4	3	2	1
										A
										B
1.00										C
										D
										E
										F
14.00										G
										H
										J
										K
7.00										L
										M

N

P

R

1.00

5.00

10.00

0.25 C

	B
0.53±0.05
0.36	C

13.00±0.10

1.40MAX.
	0.15C

SEATING PLANE

0.35±0.06

B 13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180 *A

Document #: 38-05516 Rev. *F Page 20 of 22

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