Cypress CY7C1370DV25, CY7C1372DV25 Capacitance, Thermal Resistance, AC Test Loads and Waveforms

CY7C1370DV25
CY7C1372DV25
Document #: 38-05558 Rev. *D Page 18 of 27
Capacitance[17]
Parameter Description Test Conditions 100 TQFP Package 119 BGA Package 165 FBGA Package Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 2.5V.
VDDQ = 2.5V
5 8 9 pF
CCLK Clock Input Capacitance 5 8 9 pF
CI/O Input/Output Capacitance 5 8 9 pF
Thermal Resistance[17]
Parameter Description Test Conditions 100 TQFP Package 119 BGA Package 165 FBGA Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
28.66 23.8 20.7 °C/W
ΘJC Thermal Resistance
(Junction to Case) 4.08 6.2 4.0 °C/W
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
2.5V I/O Test Load
AC Test Loads and Waveforms
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