2.Remove the heat sink (3).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE: Steps 3 and 4 apply to computer models equipped with a graphics subsystem with UMA memory. See steps 1 and 2 for heat sink removal information for computer models equipped with a graphics subsystem with discrete memory.
3.Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips screws (1) that secure the heat sink to the system board.
4.Remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it.
Component replacement procedures | 101 |