HP Performance Optimized Data Center (POD) 240a Cold aisle clearance, Grounding requirements

CAUTION: If any racks contain empty RU space, use the HP POD 240e NA filler panels to maintain the efficiency of the HP POD 240e NA thermal system. Filler panels are available from HP in 10-pack quantities (part number AQ682A) and 100-pack quantities (part number AS993A).

For more information about racks and network cabling, see the HP Performance Optimized Datacenter Networking Guide.

Cold aisle clearance

The maximum protrusion of any installed IT component directly impacts the available cold aisle clearance for removal and replacement of other IT components. Maximum component depth must follow the clear aisle distance calculations. The following figure shows how to calculate this distance.

The maximum rack face-to-cold aisle wall distance is 39.5 inches. In the figure, X represents any protrusion into the cold aisle starting from the rack face of the installed IT component (for example, the bezel). Y represents cold aisle clearance. The cold aisle clearance dictates the maximum depth (D) of any installed IT component. To find the maximum cold aisle clearance, calculate 100.33 cm (39.5 in) - X = Y.

IMPORTANT: As the value for X increases, the value for Y decreases, which also decreases the maximum depth allowed for an installed component.

Grounding requirements

The HP POD 240e NA structure and internal components are all bonded together. A common grounding electrode conductor connection point is provided on the utility end of the IT sections.

WARNING: To avoid the risk of personal injury or electric shock, the HP POD 240e NA must be properly grounded (earthed) in accordance with national, regional, and local regulations.

CAUTION: Remove paint from all grounding surfaces. Failure to do so results in an ineffective ground.

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