IBM 272 manual PC Processors Intel Celeron M, Intel→ Celeron→ M processor for mobile systems

PC Processors (Intel Celeron M)

Created by IBM PC Institute Personal Systems Reference (PSREF)

Intel→ Celeron→ M processor for mobile systems
Code name	Banias Celeron or ICP-M
Messaging	Based on an architecture designed specifically for mobile computing, the Intel Celeron M processor delivers a balanced
	level of mobile processor technology and exceptional value in sleeker, lighter notebook designs
Micro-architecture	IA-32 / micro-op fusion, dedicated stack manager, advanced branch prediction, power-optimized processor system bus
MMX™ / Streaming SIMD	MMX™ (57 new instructions) / Streaming SIMD Extensions (70 new instructions)
SSE2	Streaming SIMD Extensions 2 (144 new instructions)
Power mgmt technology	Auto Halt, Stop Grant, Deep Sleep, Deeper Sleep
L1 cache - bus	256-bit data path / full speed
L1 data cache	32KB data cache / integrated
L1 instruction cache	32KB instruction cache / integrated
L2 cache - size	512KB / full speed (Advanced Transfer Cache)
L2 cache - data path	256-bit data path (32 bytes) / 64 byte cache line size / 8-way set associative / integrated / unified (internal die; on die)
L3 cache	None
System bus	400MHz (transfers data four times per clock) / address bus transfers at two times per clock / 64 byte cache line size
Memory addressability	64GB memory addressability / 36-bit addressing / address bus is double clocked at 200MHz
System bus - width	64-bit data path
Execution units	2 integer units; 1 floating point units; 1 load unit; 1 store unit
Out-of-order instructions	Yes (out-of-order instruction execution)
Branch prediction	Dynamic (based on history)
Speculative execution	Yes (Advanced Dynamic Execution)
Math coprocessor	Pipelined floating point unit
Compatibility	Compatible with IA-32 software
Multiple processors	No SMP support
Technology (micron)	0.13u
Package and connector	Micro Flip-Chip Pin Grid Array (Micro-FCPGA) requires 479-pin surface mount Zero Insertion Force (ZIF) socket
	(mPGA479M socket) or Micro Flip-Chip Ball Grid Array (Micro-FCBGA) for surface mount (479-ball)
		Voltage	Thermal Design Power	Announce
				date
Frequency (MHz/GHz)	800MHz Ultra Low Voltage	1.004 volts	7 watts	January 2004
and available date	1.2GHz	1.356 volts	24.5 watts	January 2004
	1.3GHz	1.356 volts	24.5 watts	January 2004
Chipset support	Intel 855 chipset family
	Intel 852GM
	Other compatible chipsets

All trademarks are the property of their respective owners	(33INTEL) Compiled by Roger Dodson, IBM. January 2004
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