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IBM P5 570 manual International Technical Support Organization, Introduction, July

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International Technical Support Organization

IBM Sserver p5 570 Technical Overview and

Introduction

July 2004

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IBM P5 570 International Technical Support Organization, IBM Sserver p5 570 Technical Overview and, Introduction, July

Contents

Giuliano Anselmi Gregor Linzmeier IBM Eserver p5 Technical Overviewand Introduction Extreme flexibility with outstanding performancePage July International Technical Support OrganizationIBM Sserver p5 570 Technical Overview and IntroductionFirst Edition July Contents ivp5-570Technical Overview and Introduction Contents vip5-570Technical Overview and Introduction Notices Trademarks The team that wrote this Redpaper PrefaceIBM UK Become a published authorComments welcome IBM U.SChapter 1. General description 2p5-570Technical Overview and Introduction Description 1.1 System specifications1.2 Physical package Dimension1.3 Minimum and optional features 1.3.1 Processor card features Feature Code 1.3.2Memory features1.3.3 Disk and media features Feature code1.3.4 USB diskette drive 1.3.5 I/O drawers7311 Model D10 I/O drawer 7311 Model D10 I/O drawer physical package 7311 Model D11 I/O drawer 7311 Model D20 I/O drawer7311 Model D11 I/O drawer physical package 7311 Model D20 I/O drawer physical package I/O drawers and usable PCI slots1.3.6 Hardware Management Console models 1.4 Value PaksProcessors, FC 1.5 Model type conversion1.6 System racks Value1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack 1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack 1.6.3AC Power Distribution Unit and rack contentFlat panel display options 1.6.5 Additional options for rackHardware Management Console 7310 Model CR2 1.6.6OEM rack1.7 Statement of direction 18p5-570Technical Overview and Introduction Figure 2-1 p5-570logic data flow Chapter 2. Architecture and technical overview2.1 The POWER5 chip POWER4POWER5 ST operation 2.1.2 Dynamic power managementEnhanced SMT features 2.1.1 Simultaneous multi-threadingPOWER5TM 2.1.3 The POWER chip evolution2.2 Processor cards 2.1.4 CMOS, copper, and SOI technologySMI SMI 24p5-570Technical Overview and Introduction 2.2.1 Processor drawer interconnect cablespmcycles -m 2.2.2 Processor clock rate2.3.1 Memory placement rules 2.3 Memory subsystem2.3.2 Memory restriction 11S1234567YL12345678901 FRU P/N EC Level 2.4 System buses2.3.3 Memory throughput 2.4.1 RIO-2buses and GX+ card2.5 Internal I/O subsystem 2.4.2 SP bus2.5.1 PCI-Xslots and adapters 64-bitand 32-bitadapters 2.5.2 LAN adapters2.5.3 Graphic accelerators 2.5.4 SCSI adapters2.6.1 Internal hot swappable SCSI disks 2.6 Internal storage2.6.2 Internal RAID options 2.6.3 Internal media devicesHot-swapdisks and Linux 2.7.1 I/O drawers 2.7 External I/O subsystems7311 Model D10 features 7311 Model D11 features2.7.3 7311 Model D20 I/O drawer 7311 Model D20 internal SCSI cabling 2.7.4 7311 I/O drawer and RIO-2cabling2.7.57311 I/O drawer and SPCN cabling Cost OptimizedPerformance Optimized IBM 2104 Expandable Storage Plus 2.7.6External disk subsystemsIBM 7133 Serial Disk Subsystem SSA IBM TotalStorage FAStT Storage serversIBM TotalStorage Enterprise Storage Server 2.9.1 Virtual Ethernet 2.9.2 Advanced POWER Virtualization feature2.8 Dynamic logical partitioning 2.9 VirtualizationMicro-Partitioningtechnology Shared Ethernet adapter POWER5 PartitioningPOWER Hypervisor Virtual I/O ServerPartition Load Manager 2.10 Service processor2.10.2Service processor - extender 2.10.1 Service processor - base2.11 Boot process 2.11.3IPL flow with an HMC attached to the system 2.11.2Hardware Management Console2.11.4 Definitions of partitions Managed systemsProfiles Memory 2.11.7 System Management Services2.11.5Hardware requirements for partitioning ProcessorsFigure 2-17System Management Services main menu 2.11.8 Boot options2.11.9Additional boot options DVD-ROM, DVD-RAMExternal tape drives 2.11.10 Security SAN bootLAN boot 2.12 Operating system requirementsLinux support 2.12.2 LinuxPage 3.1 Capacity on Demand 2-way1.65 GHz POWER5 processor cardReserve Capacity on Demand 3.1.2 Capacity Upgrade on Demand for memoryCapacity Upgrade on Demand On/Off Capacity on DemandOn/Off Capacity on Demand 3.2Reliability, availability, and serviceability 3.2.1 Fault avoidance3.1.4Trial Capacity on Demand 3.2.2 First Failure Data Capture 3.2.3 Permanent monitoringMutual surveillance Environmental monitoring 3.2.4Self-healingDynamic or persistent deallocation 3.2.6Fault masking3.2.5 N+1 redundancy 3.2.7Resource deallocationError indication and LED indicators 3.2.8 ServiceabilitySystem Attention LED Concurrent Maintenance3.3Manageability 3.3.1 Advanced System Management Interface3.3.2 Service Agent 3.3.4 Service Update Management Assistant Service focal point3.3.3 p5 Customer-ManagedMicrocode 3.4 Cluster CSM value points CSM V1.4 on AIX and Linux planned 4Q0464p5-570Technical Overview and Introduction Related publications IBM RedbooksOther publications 66p5-570Technical Overview and Introduction Online resourcesHelp from IBM How to get IBM Redbooks68p5-570Technical Overview and Introduction Page and Introduction For more information: ibm.com/redbooksIBM Eserver p5 Technical Overview