Manuals / IBM / Computer Equipment / Server

IBM P5 570 manual 2.11.9Additional boot options, Dvd-Rom, Dvd-Ram, External tape drives

Models: P5 570

1 82

Download 82 pages 52.29 Kb

Page 60

2.11.9Additional boot options

partition displays the SMS menus, all of the necessary tests have been performed and the machine is scanning the bus for a boot source.

Most system backplanes are designed such that the drive in the first slot spins up immediately after power-on, and other drives will wait for the operating system to send a command before spinning up. Disk drive bays 1 and 4 are hard-wired to spin up immediately. The left-most slot of the 3-pack disk backplanes (SCSI ID 5, boot, autostart) is set to spin up immediately after power-on. The power-on delay sequence is performed to prevent power supply overloading. This behavior makes the disk in the first slot of the first 3-pack DASD backplane the preferred boot device. See Figure 2-18to locate all of the disk bays.

3-pack #1

3-pack #2

SCSI ID=5

SCSI ID=4

SCSI ID=3

SCSI ID=5

SCSI ID=4

SCSI ID=3

Disk bay	#1 #2 #3 #4 #5 #6

Figure 2-18 Disk bays and SCSI addresses within a p5-570 building block

When SMS menus are available, the Select Boot Options menu can be used to view and set various options regarding the installation devices and boot devices:

1.Select Install or Boot a Device

Enables you to select a device to boot from or install the operating system from. This selection is only for the current boot.

2.Select Boot Devices

Enables you to set the boot list.

3.Multiboot Startup

Toggles the multiboot startup flag, which controls whether the multiboot menu is invoked automatically on startup.

2.11.9Additional boot options

Instead of booting from the preferred boot device or from any other internal disks, there are a number of other possibilities:

DVD-ROM, DVD-RAM	These devices can be used to boot the system or a
	logical partition (if the resource is available to the specific
	partition), so that a system can be loaded, or system
	maintenance or stand-alone diagnostics can be
	performed.
External tape drives	Any externally attached tape drive can be used to boot
	the system, or a logical partition if the resource is

48p5-570 Technical Overview and Introduction

Image 60

IBM P5 570 manual 2.11.9Additional boot options, Dvd-Rom, Dvd-Ram, External tape drives

Contents

IBM Eserver p5 Technical Overview and IntroductionExtreme flexibility with outstanding performance Giuliano Anselmi Gregor LinzmeierPage International Technical Support Organization IBM Sserver p5 570 Technical Overview andIntroduction JulyFirst Edition July Contents ivp5-570Technical Overview and Introduction Contents vip5-570Technical Overview and Introduction Notices Trademarks Preface The team that wrote this RedpaperBecome a published author Comments welcomeIBM U.S IBM UKChapter 1. General description 2p5-570Technical Overview and Introduction 1.1 System specifications 1.2 Physical packageDimension Description1.3 Minimum and optional features 1.3.1 Processor card features 1.3.2Memory features 1.3.3 Disk and media featuresFeature code Feature Code1.3.4 USB diskette drive 1.3.5 I/O drawers7311 Model D10 I/O drawer 7311 Model D10 I/O drawer physical package 7311 Model D11 I/O drawer 7311 Model D20 I/O drawer7311 Model D11 I/O drawer physical package I/O drawers and usable PCI slots 7311 Model D20 I/O drawer physical package1.4 Value Paks 1.3.6 Hardware Management Console models1.5 Model type conversion 1.6 System racksValue Processors, FC1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack 1.6.3AC Power Distribution Unit and rack content 1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack1.6.5 Additional options for rack Flat panel display options1.6.6OEM rack Hardware Management Console 7310 Model CR21.7 Statement of direction 18p5-570Technical Overview and Introduction Chapter 2. Architecture and technical overview Figure 2-1 p5-570logic data flow2.1 The POWER5 chip POWER4POWER5 2.1.2 Dynamic power management Enhanced SMT features2.1.1 Simultaneous multi-threading ST operation2.1.3 The POWER chip evolution POWER5TM2.2 Processor cards 2.1.4 CMOS, copper, and SOI technologySMI SMI 2.2.1 Processor drawer interconnect cables 24p5-570Technical Overview and Introduction2.2.2 Processor clock rate pmcycles -m2.3.1 Memory placement rules 2.3 Memory subsystem2.3.2 Memory restriction 2.4 System buses 2.3.3 Memory throughput2.4.1 RIO-2buses and GX+ card 11S1234567YL12345678901 FRU P/N EC Level2.5 Internal I/O subsystem 2.4.2 SP bus2.5.1 PCI-Xslots and adapters 2.5.2 LAN adapters 2.5.3 Graphic accelerators2.5.4 SCSI adapters 64-bitand 32-bitadapters2.6 Internal storage 2.6.1 Internal hot swappable SCSI disks2.6.2 Internal RAID options 2.6.3 Internal media devicesHot-swapdisks and Linux 2.7 External I/O subsystems 2.7.1 I/O drawers7311 Model D10 features 7311 Model D11 features2.7.3 7311 Model D20 I/O drawer 2.7.4 7311 I/O drawer and RIO-2cabling 7311 Model D20 internal SCSI cabling2.7.57311 I/O drawer and SPCN cabling Cost OptimizedPerformance Optimized 2.7.6External disk subsystems IBM 2104 Expandable Storage PlusIBM 7133 Serial Disk Subsystem SSA IBM TotalStorage FAStT Storage serversIBM TotalStorage Enterprise Storage Server 2.9.2 Advanced POWER Virtualization feature 2.8 Dynamic logical partitioning2.9 Virtualization 2.9.1 Virtual EthernetMicro-Partitioningtechnology POWER5 Partitioning POWER HypervisorVirtual I/O Server Shared Ethernet adapter2.10 Service processor Partition Load Manager2.10.1 Service processor - base 2.10.2Service processor - extender2.11 Boot process 2.11.2Hardware Management Console 2.11.3IPL flow with an HMC attached to the system2.11.4 Definitions of partitions Managed systemsProfiles 2.11.7 System Management Services 2.11.5Hardware requirements for partitioningProcessors Memory2.11.8 Boot options Figure 2-17System Management Services main menu2.11.9Additional boot options DVD-ROM, DVD-RAMExternal tape drives SAN boot LAN boot2.12 Operating system requirements 2.11.10 Security2.12.2 Linux Linux supportPage 2-way1.65 GHz POWER5 processor card 3.1 Capacity on Demand3.1.2 Capacity Upgrade on Demand for memory Capacity Upgrade on DemandOn/Off Capacity on Demand Reserve Capacity on DemandOn/Off Capacity on Demand 3.2Reliability, availability, and serviceability 3.2.1 Fault avoidance3.1.4Trial Capacity on Demand 3.2.2 First Failure Data Capture 3.2.3 Permanent monitoringMutual surveillance 3.2.4Self-healing Environmental monitoring3.2.6Fault masking 3.2.5 N+1 redundancy3.2.7Resource deallocation Dynamic or persistent deallocation3.2.8 Serviceability Error indication and LED indicatorsConcurrent Maintenance 3.3Manageability3.3.1 Advanced System Management Interface System Attention LED3.3.2 Service Agent 3.3.4 Service Update Management Assistant Service focal point3.3.3 p5 Customer-ManagedMicrocode 3.4 Cluster CSM value points CSM V1.4 on AIX and Linux planned 4Q0464p5-570Technical Overview and Introduction Related publications IBM RedbooksOther publications Online resources 66p5-570Technical Overview and IntroductionHow to get IBM Redbooks Help from IBM68p5-570Technical Overview and Introduction Page For more information: ibm.com/redbooks IBM Eserver p5Technical Overview and Introduction