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IBM P5 570 manual Capacity on Demand, 2-way1.65 GHz POWER5 processor card

Models: P5 570

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3.1 Capacity on Demand

p5-570 systems can be shipped with non-activated resources (processors and memory), which may be added as they are needed. Processors and memory can be brought online to meet increasing workload demands without affecting system operations.

The CoD is supported on p5 Model 570 when the 1.65 GHz and 1.9 GHz Power5 processors are used.

The following sections outline the different methods that are available, namely:

Processor

–Capacity Upgrade on Demand

–Reserve Capacity on Demand

–Dynamic processor sparing

Memory

–Permanent Capacity Upgrade on Demand for Memory

–On/Off Capacity on Demand

–Reserve Capacity on Demand

Processor and Memory

–Trial Capacity on Demand for processors and memory

The following sections describe the processor cards that support the CUoD features.

2-way 1.65 GHz POWER5 processor card

The base 2-way 1.65 GHz POWER5 processor card (FC 7830) features two processors (but 0 active) and eight DDR1 Memory DIMM sockets. Processors are activated in increments of one processor, either permanently or for a given amount of time.

2-way 1.9 GHz POWER5 processor card with DDR1 memory slots

The 2-way 1.9 GHz POWER5 processor card (FC 7832) features two processors (but 0 active) and eight DDR1 Memory DIMM sockets. Processors are activated in increments of one processor, either permanently or for a given amount of time.

2-way 1.9 GHz POWER5 processor card with DDR2 memory slots

The 2-way 1.9 GHz POWER5 processor card (FC 7833) features two processors (but 0 active) and eight DDR2 Memory DIMM sockets. Processors are activated in increments of one processor, either permanently or for a given amount of time.

Note: The 2-way 1.5 POWER5 processor card does not support any CUoD feature.

Processor and memory Capacity Upgrade On Demand and Dynamic processor sparing is supported by AIX 5L Version 5.2 ML4 (IY56722) or AIX 5L Version 5.3. Dynamic processor sparing requires that the CPU guard attribute is set to enable.

3.1.1 Processor Capacity Upgrade on Demand methods

This section describes the different CUoD methods that are available for the processors at time of writing.

52p5-570 Technical Overview and Introduction

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IBM P5 570 manual Capacity on Demand, 2-way1.65 GHz POWER5 processor card

Contents

IBM Eserver p5 Technical Overview and IntroductionExtreme flexibility with outstanding performance Giuliano Anselmi Gregor LinzmeierPage International Technical Support Organization IBM Sserver p5 570 Technical Overview andIntroduction JulyFirst Edition July Contents ivp5-570Technical Overview and Introduction Contents vip5-570Technical Overview and Introduction Notices Trademarks Preface The team that wrote this RedpaperBecome a published author Comments welcomeIBM U.S IBM UKChapter 1. General description 2p5-570Technical Overview and Introduction 1.1 System specifications 1.2 Physical packageDimension Description1.3 Minimum and optional features 1.3.1 Processor card features 1.3.2Memory features 1.3.3 Disk and media featuresFeature code Feature Code1.3.5 I/O drawers 1.3.4 USB diskette drive7311 Model D10 I/O drawer 7311 Model D10 I/O drawer physical package 7311 Model D20 I/O drawer 7311 Model D11 I/O drawer7311 Model D11 I/O drawer physical package I/O drawers and usable PCI slots 7311 Model D20 I/O drawer physical package1.4 Value Paks 1.3.6 Hardware Management Console models1.5 Model type conversion 1.6 System racksValue Processors, FC1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack 1.6.3AC Power Distribution Unit and rack content 1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack1.6.5 Additional options for rack Flat panel display options1.6.6OEM rack Hardware Management Console 7310 Model CR21.7 Statement of direction 18p5-570Technical Overview and Introduction Chapter 2. Architecture and technical overview Figure 2-1 p5-570logic data flowPOWER4 2.1 The POWER5 chipPOWER5 2.1.2 Dynamic power management Enhanced SMT features2.1.1 Simultaneous multi-threading ST operation2.1.3 The POWER chip evolution POWER5TM2.1.4 CMOS, copper, and SOI technology 2.2 Processor cardsSMI SMI 2.2.1 Processor drawer interconnect cables 24p5-570Technical Overview and Introduction2.2.2 Processor clock rate pmcycles -m2.3 Memory subsystem 2.3.1 Memory placement rules2.3.2 Memory restriction 2.4 System buses 2.3.3 Memory throughput2.4.1 RIO-2buses and GX+ card 11S1234567YL12345678901 FRU P/N EC Level2.4.2 SP bus 2.5 Internal I/O subsystem2.5.1 PCI-Xslots and adapters 2.5.2 LAN adapters 2.5.3 Graphic accelerators2.5.4 SCSI adapters 64-bitand 32-bitadapters2.6 Internal storage 2.6.1 Internal hot swappable SCSI disks2.6.3 Internal media devices 2.6.2 Internal RAID optionsHot-swapdisks and Linux 2.7 External I/O subsystems 2.7.1 I/O drawers7311 Model D11 features 7311 Model D10 features2.7.3 7311 Model D20 I/O drawer 2.7.4 7311 I/O drawer and RIO-2cabling 7311 Model D20 internal SCSI cablingCost Optimized 2.7.57311 I/O drawer and SPCN cablingPerformance Optimized 2.7.6External disk subsystems IBM 2104 Expandable Storage PlusIBM TotalStorage FAStT Storage servers IBM 7133 Serial Disk Subsystem SSAIBM TotalStorage Enterprise Storage Server 2.9.2 Advanced POWER Virtualization feature 2.8 Dynamic logical partitioning2.9 Virtualization 2.9.1 Virtual EthernetMicro-Partitioningtechnology POWER5 Partitioning POWER HypervisorVirtual I/O Server Shared Ethernet adapter2.10 Service processor Partition Load Manager2.10.1 Service processor - base 2.10.2Service processor - extender2.11 Boot process 2.11.2Hardware Management Console 2.11.3IPL flow with an HMC attached to the systemManaged systems 2.11.4 Definitions of partitionsProfiles 2.11.7 System Management Services 2.11.5Hardware requirements for partitioningProcessors Memory2.11.8 Boot options Figure 2-17System Management Services main menuDVD-ROM, DVD-RAM 2.11.9Additional boot optionsExternal tape drives SAN boot LAN boot2.12 Operating system requirements 2.11.10 Security2.12.2 Linux Linux supportPage 2-way1.65 GHz POWER5 processor card 3.1 Capacity on Demand3.1.2 Capacity Upgrade on Demand for memory Capacity Upgrade on DemandOn/Off Capacity on Demand Reserve Capacity on DemandOn/Off Capacity on Demand 3.2.1 Fault avoidance 3.2Reliability, availability, and serviceability3.1.4Trial Capacity on Demand 3.2.3 Permanent monitoring 3.2.2 First Failure Data CaptureMutual surveillance 3.2.4Self-healing Environmental monitoring3.2.6Fault masking 3.2.5 N+1 redundancy3.2.7Resource deallocation Dynamic or persistent deallocation3.2.8 Serviceability Error indication and LED indicatorsConcurrent Maintenance 3.3Manageability3.3.1 Advanced System Management Interface System Attention LED3.3.2 Service Agent Service focal point 3.3.4 Service Update Management Assistant3.3.3 p5 Customer-ManagedMicrocode 3.4 Cluster CSM V1.4 on AIX and Linux planned 4Q04 CSM value points64p5-570Technical Overview and Introduction IBM Redbooks Related publicationsOther publications Online resources 66p5-570Technical Overview and IntroductionHow to get IBM Redbooks Help from IBM68p5-570Technical Overview and Introduction Page For more information: ibm.com/redbooks IBM Eserver p5Technical Overview and Introduction