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IBM P5 570 manual 2.7.57311 I/O drawer and SPCN cabling, Cost Optimized, Performance Optimized

Models: P5 570

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Cost Optimized

Each RIO-2 port can operate at 1 GHz in bidirectional mode and is capable of passing data in each direction on each cycle of the port. Therefore, the maximum data rate is 4 GBps per I/O drawer in double barrel mode.

There is one default primary RIO-2 loop in any p5-570 building block. This feature provides two Remote I/O ports for attaching up to four 7311 Model D10, 7311 Model D11, or 7311 Model D20 I/O drawers to the system in a single loop. Different I/O drawer models can be used in the same loop, but the combination of I/O drawers must be a total of four per single loop. The optional RIO-2 expansion card may be used to increase the number of I/O drawers that can be connected to one p5-570 building block, and the same rules of the default RIO-2 loop must be considered. The method that is used to connect the drawers to the RIO-2 loop is important for performance. Figure 2-13 on page 35 shows how you could connect four I/O drawers to one p5-570 building block. This is a logical view, actual cables should be wired according to installation instructions.

Cost Optimized

Performance Optimized

PCI-X slots

I/O drawer #1

I/O drawer #3

I/O drawer #1

I/O drawer #2

I/O drawer #4

I/O drawer #2

I/O drawer #3

I/O drawer #4

Figure 2-13 RIO-2 cabling examples

Note: If you have 20 I/O drawers, although there are no restrictions on their placement, this can affect performance.

RIO-2 cables are available in different lengths to satisfy different connection requirements:

Remote I/O cable, 1.2 m (FC 3146, for between D10 and D11 drawers only)

Remote I/O cable, 3.5 m (FC 3147)

Remote I/O cable, 10 m (FC 3148)

2.7.57311 I/O drawer and SPCN cabling

SPCN5 is used to control and monitor the status of power and cooling within the I/O drawer. SPCN is a loop: Cabling starts from SPCN port 0 on the p5-570 to SPCN port 0 on the first I/O drawer. The loop is closed, connecting the SPCN port 1 of the I/O drawer back to port 1 of

5System Power Control Network

Chapter 2. Architecture and technical overview 35

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IBM P5 570 manual 2.7.57311 I/O drawer and SPCN cabling, Cost Optimized, Performance Optimized

Contents

Giuliano Anselmi Gregor Linzmeier IBM Eserver p5 Technical Overviewand Introduction Extreme flexibility with outstanding performancePage July International Technical Support OrganizationIBM Sserver p5 570 Technical Overview and IntroductionFirst Edition July Contents ivp5-570Technical Overview and Introduction Contents vip5-570Technical Overview and Introduction Notices Trademarks The team that wrote this Redpaper PrefaceIBM UK Become a published authorComments welcome IBM U.SChapter 1. General description 2p5-570Technical Overview and Introduction Description 1.1 System specifications1.2 Physical package Dimension1.3 Minimum and optional features 1.3.1 Processor card features Feature Code 1.3.2Memory features1.3.3 Disk and media features Feature code7311 Model D10 I/O drawer 1.3.4 USB diskette drive1.3.5 I/O drawers 7311 Model D10 I/O drawer physical package 7311 Model D11 I/O drawer physical package 7311 Model D11 I/O drawer7311 Model D20 I/O drawer 7311 Model D20 I/O drawer physical package I/O drawers and usable PCI slots1.3.6 Hardware Management Console models 1.4 Value PaksProcessors, FC 1.5 Model type conversion1.6 System racks Value1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack 1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack 1.6.3AC Power Distribution Unit and rack contentFlat panel display options 1.6.5 Additional options for rackHardware Management Console 7310 Model CR2 1.6.6OEM rack1.7 Statement of direction 18p5-570Technical Overview and Introduction Figure 2-1 p5-570logic data flow Chapter 2. Architecture and technical overviewPOWER5 2.1 The POWER5 chipPOWER4 ST operation 2.1.2 Dynamic power managementEnhanced SMT features 2.1.1 Simultaneous multi-threadingPOWER5TM 2.1.3 The POWER chip evolutionSMI SMI 2.2 Processor cards2.1.4 CMOS, copper, and SOI technology 24p5-570Technical Overview and Introduction 2.2.1 Processor drawer interconnect cablespmcycles -m 2.2.2 Processor clock rate2.3.2 Memory restriction 2.3.1 Memory placement rules2.3 Memory subsystem 11S1234567YL12345678901 FRU P/N EC Level 2.4 System buses2.3.3 Memory throughput 2.4.1 RIO-2buses and GX+ card2.5.1 PCI-Xslots and adapters 2.5 Internal I/O subsystem2.4.2 SP bus 64-bitand 32-bitadapters 2.5.2 LAN adapters2.5.3 Graphic accelerators 2.5.4 SCSI adapters2.6.1 Internal hot swappable SCSI disks 2.6 Internal storageHot-swapdisks and Linux 2.6.2 Internal RAID options2.6.3 Internal media devices 2.7.1 I/O drawers 2.7 External I/O subsystems2.7.3 7311 Model D20 I/O drawer 7311 Model D10 features7311 Model D11 features 7311 Model D20 internal SCSI cabling 2.7.4 7311 I/O drawer and RIO-2cablingPerformance Optimized 2.7.57311 I/O drawer and SPCN cablingCost Optimized IBM 2104 Expandable Storage Plus 2.7.6External disk subsystemsIBM TotalStorage Enterprise Storage Server IBM 7133 Serial Disk Subsystem SSAIBM TotalStorage FAStT Storage servers 2.9.1 Virtual Ethernet 2.9.2 Advanced POWER Virtualization feature2.8 Dynamic logical partitioning 2.9 VirtualizationMicro-Partitioningtechnology Shared Ethernet adapter POWER5 PartitioningPOWER Hypervisor Virtual I/O ServerPartition Load Manager 2.10 Service processor2.10.2Service processor - extender 2.10.1 Service processor - base2.11 Boot process 2.11.3IPL flow with an HMC attached to the system 2.11.2Hardware Management ConsoleProfiles 2.11.4 Definitions of partitionsManaged systems Memory 2.11.7 System Management Services2.11.5Hardware requirements for partitioning ProcessorsFigure 2-17System Management Services main menu 2.11.8 Boot optionsExternal tape drives 2.11.9Additional boot optionsDVD-ROM, DVD-RAM 2.11.10 Security SAN bootLAN boot 2.12 Operating system requirementsLinux support 2.12.2 LinuxPage 3.1 Capacity on Demand 2-way1.65 GHz POWER5 processor cardReserve Capacity on Demand 3.1.2 Capacity Upgrade on Demand for memoryCapacity Upgrade on Demand On/Off Capacity on DemandOn/Off Capacity on Demand 3.1.4Trial Capacity on Demand 3.2Reliability, availability, and serviceability3.2.1 Fault avoidance Mutual surveillance 3.2.2 First Failure Data Capture3.2.3 Permanent monitoring Environmental monitoring 3.2.4Self-healingDynamic or persistent deallocation 3.2.6Fault masking3.2.5 N+1 redundancy 3.2.7Resource deallocationError indication and LED indicators 3.2.8 ServiceabilitySystem Attention LED Concurrent Maintenance3.3Manageability 3.3.1 Advanced System Management Interface3.3.2 Service Agent 3.3.3 p5 Customer-ManagedMicrocode 3.3.4 Service Update Management AssistantService focal point 3.4 Cluster 64p5-570Technical Overview and Introduction CSM value pointsCSM V1.4 on AIX and Linux planned 4Q04 Other publications Related publicationsIBM Redbooks 66p5-570Technical Overview and Introduction Online resourcesHelp from IBM How to get IBM Redbooks68p5-570Technical Overview and Introduction Page and Introduction For more information: ibm.com/redbooksIBM Eserver p5 Technical Overview