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P5 570 manual
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P5 570
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Specification
Error messages
Memory placement rules
Maintenance
Fault avoidance
How to
The POWER5 chip
Service processor
Capacity Upgrade on Demand
Minimum and optional features
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Contents
and Introduction
IBM Eserver p5 Technical Overview
Extreme flexibility with outstanding performance
Giuliano Anselmi Gregor Linzmeier
Page
IBM Sserver p5 570 Technical Overview and
International Technical Support Organization
Introduction
July
First Edition July
Contents
ivp5-570Technical Overview and Introduction
Contents
vip5-570Technical Overview and Introduction
Notices
Trademarks
The team that wrote this Redpaper
Preface
Comments welcome
Become a published author
IBM U.S
IBM UK
Chapter 1. General description
2p5-570Technical Overview and Introduction
1.2 Physical package
1.1 System specifications
Dimension
Description
1.3 Minimum and optional features
1.3.1 Processor card features
1.3.3 Disk and media features
1.3.2Memory features
Feature code
Feature Code
1.3.4 USB diskette drive
1.3.5 I/O drawers
7311 Model D10 I/O drawer
7311 Model D10 I/O drawer physical package
7311 Model D11 I/O drawer
7311 Model D20 I/O drawer
7311 Model D11 I/O drawer physical package
7311 Model D20 I/O drawer physical package
I/O drawers and usable PCI slots
1.3.6 Hardware Management Console models
1.4 Value Paks
1.6 System racks
1.5 Model type conversion
Value
Processors, FC
1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack
1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack
1.6.3AC Power Distribution Unit and rack content
Flat panel display options
1.6.5 Additional options for rack
Hardware Management Console 7310 Model CR2
1.6.6OEM rack
1.7 Statement of direction
18p5-570Technical Overview and Introduction
Figure 2-1 p5-570logic data flow
Chapter 2. Architecture and technical overview
2.1 The POWER5 chip
POWER4
POWER5
Enhanced SMT features
2.1.2 Dynamic power management
2.1.1 Simultaneous multi-threading
ST operation
POWER5TM
2.1.3 The POWER chip evolution
2.2 Processor cards
2.1.4 CMOS, copper, and SOI technology
SMI SMI
24p5-570Technical Overview and Introduction
2.2.1 Processor drawer interconnect cables
pmcycles -m
2.2.2 Processor clock rate
2.3.1 Memory placement rules
2.3 Memory subsystem
2.3.2 Memory restriction
2.3.3 Memory throughput
2.4 System buses
2.4.1 RIO-2buses and GX+ card
11S1234567YL12345678901 FRU P/N EC Level
2.5 Internal I/O subsystem
2.4.2 SP bus
2.5.1 PCI-Xslots and adapters
2.5.3 Graphic accelerators
2.5.2 LAN adapters
2.5.4 SCSI adapters
64-bitand 32-bitadapters
2.6.1 Internal hot swappable SCSI disks
2.6 Internal storage
2.6.2 Internal RAID options
2.6.3 Internal media devices
Hot-swapdisks and Linux
2.7.1 I/O drawers
2.7 External I/O subsystems
7311 Model D10 features
7311 Model D11 features
2.7.3 7311 Model D20 I/O drawer
7311 Model D20 internal SCSI cabling
2.7.4 7311 I/O drawer and RIO-2cabling
2.7.57311 I/O drawer and SPCN cabling
Cost Optimized
Performance Optimized
IBM 2104 Expandable Storage Plus
2.7.6External disk subsystems
IBM 7133 Serial Disk Subsystem SSA
IBM TotalStorage FAStT Storage servers
IBM TotalStorage Enterprise Storage Server
2.8 Dynamic logical partitioning
2.9.2 Advanced POWER Virtualization feature
2.9 Virtualization
2.9.1 Virtual Ethernet
Micro-Partitioningtechnology
POWER Hypervisor
POWER5 Partitioning
Virtual I/O Server
Shared Ethernet adapter
Partition Load Manager
2.10 Service processor
2.10.2Service processor - extender
2.10.1 Service processor - base
2.11 Boot process
2.11.3IPL flow with an HMC attached to the system
2.11.2Hardware Management Console
2.11.4 Definitions of partitions
Managed systems
Profiles
2.11.5Hardware requirements for partitioning
2.11.7 System Management Services
Processors
Memory
Figure 2-17System Management Services main menu
2.11.8 Boot options
2.11.9Additional boot options
DVD-ROM, DVD-RAM
External tape drives
LAN boot
SAN boot
2.12 Operating system requirements
2.11.10 Security
Linux support
2.12.2 Linux
Page
3.1 Capacity on Demand
2-way1.65 GHz POWER5 processor card
Capacity Upgrade on Demand
3.1.2 Capacity Upgrade on Demand for memory
On/Off Capacity on Demand
Reserve Capacity on Demand
On/Off Capacity on Demand
3.2Reliability, availability, and serviceability
3.2.1 Fault avoidance
3.1.4Trial Capacity on Demand
3.2.2 First Failure Data Capture
3.2.3 Permanent monitoring
Mutual surveillance
Environmental monitoring
3.2.4Self-healing
3.2.5 N+1 redundancy
3.2.6Fault masking
3.2.7Resource deallocation
Dynamic or persistent deallocation
Error indication and LED indicators
3.2.8 Serviceability
3.3Manageability
Concurrent Maintenance
3.3.1 Advanced System Management Interface
System Attention LED
3.3.2 Service Agent
3.3.4 Service Update Management Assistant
Service focal point
3.3.3 p5 Customer-ManagedMicrocode
3.4 Cluster
CSM value points
CSM V1.4 on AIX and Linux planned 4Q04
64p5-570Technical Overview and Introduction
Related publications
IBM Redbooks
Other publications
66p5-570Technical Overview and Introduction
Online resources
Help from IBM
How to get IBM Redbooks
68p5-570Technical Overview and Introduction
Page
IBM Eserver p5
For more information: ibm.com/redbooks
Technical Overview
and Introduction