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P5 570 manual 18p5-570Technical Overview and Introduction
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P5 570
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Specification
Error codes
Memory placement rules
Maintenance
Fault avoidance
How to
The POWER5 chip
Service processor
Capacity Upgrade on Demand
Minimum and optional features
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p5-570
Technical Overview and Introduction
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Contents
Extreme flexibility with outstanding performance
IBM Eserver p5 Technical Overview
and Introduction
Giuliano Anselmi Gregor Linzmeier
Page
Introduction
International Technical Support Organization
IBM Sserver p5 570 Technical Overview and
July
First Edition July
Contents
ivp5-570Technical Overview and Introduction
Contents
vip5-570Technical Overview and Introduction
Notices
Trademarks
Preface
The team that wrote this Redpaper
IBM U.S
Become a published author
Comments welcome
IBM UK
Chapter 1. General description
2p5-570Technical Overview and Introduction
Dimension
1.1 System specifications
1.2 Physical package
Description
1.3 Minimum and optional features
1.3.1 Processor card features
Feature code
1.3.2Memory features
1.3.3 Disk and media features
Feature Code
1.3.4 USB diskette drive
1.3.5 I/O drawers
7311 Model D10 I/O drawer
7311 Model D10 I/O drawer physical package
7311 Model D11 I/O drawer
7311 Model D20 I/O drawer
7311 Model D11 I/O drawer physical package
I/O drawers and usable PCI slots
7311 Model D20 I/O drawer physical package
1.4 Value Paks
1.3.6 Hardware Management Console models
Value
1.5 Model type conversion
1.6 System racks
Processors, FC
1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack
1.6.3AC Power Distribution Unit and rack content
1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack
1.6.5 Additional options for rack
Flat panel display options
1.6.6OEM rack
Hardware Management Console 7310 Model CR2
1.7 Statement of direction
18p5-570Technical Overview and Introduction
Chapter 2. Architecture and technical overview
Figure 2-1 p5-570logic data flow
2.1 The POWER5 chip
POWER4
POWER5
2.1.1 Simultaneous multi-threading
2.1.2 Dynamic power management
Enhanced SMT features
ST operation
2.1.3 The POWER chip evolution
POWER5TM
2.2 Processor cards
2.1.4 CMOS, copper, and SOI technology
SMI SMI
2.2.1 Processor drawer interconnect cables
24p5-570Technical Overview and Introduction
2.2.2 Processor clock rate
pmcycles -m
2.3.1 Memory placement rules
2.3 Memory subsystem
2.3.2 Memory restriction
2.4.1 RIO-2buses and GX+ card
2.4 System buses
2.3.3 Memory throughput
11S1234567YL12345678901 FRU P/N EC Level
2.5 Internal I/O subsystem
2.4.2 SP bus
2.5.1 PCI-Xslots and adapters
2.5.4 SCSI adapters
2.5.2 LAN adapters
2.5.3 Graphic accelerators
64-bitand 32-bitadapters
2.6 Internal storage
2.6.1 Internal hot swappable SCSI disks
2.6.2 Internal RAID options
2.6.3 Internal media devices
Hot-swapdisks and Linux
2.7 External I/O subsystems
2.7.1 I/O drawers
7311 Model D10 features
7311 Model D11 features
2.7.3 7311 Model D20 I/O drawer
2.7.4 7311 I/O drawer and RIO-2cabling
7311 Model D20 internal SCSI cabling
2.7.57311 I/O drawer and SPCN cabling
Cost Optimized
Performance Optimized
2.7.6External disk subsystems
IBM 2104 Expandable Storage Plus
IBM 7133 Serial Disk Subsystem SSA
IBM TotalStorage FAStT Storage servers
IBM TotalStorage Enterprise Storage Server
2.9 Virtualization
2.9.2 Advanced POWER Virtualization feature
2.8 Dynamic logical partitioning
2.9.1 Virtual Ethernet
Micro-Partitioningtechnology
Virtual I/O Server
POWER5 Partitioning
POWER Hypervisor
Shared Ethernet adapter
2.10 Service processor
Partition Load Manager
2.10.1 Service processor - base
2.10.2Service processor - extender
2.11 Boot process
2.11.2Hardware Management Console
2.11.3IPL flow with an HMC attached to the system
2.11.4 Definitions of partitions
Managed systems
Profiles
Processors
2.11.7 System Management Services
2.11.5Hardware requirements for partitioning
Memory
2.11.8 Boot options
Figure 2-17System Management Services main menu
2.11.9Additional boot options
DVD-ROM, DVD-RAM
External tape drives
2.12 Operating system requirements
SAN boot
LAN boot
2.11.10 Security
2.12.2 Linux
Linux support
Page
2-way1.65 GHz POWER5 processor card
3.1 Capacity on Demand
On/Off Capacity on Demand
3.1.2 Capacity Upgrade on Demand for memory
Capacity Upgrade on Demand
Reserve Capacity on Demand
On/Off Capacity on Demand
3.2Reliability, availability, and serviceability
3.2.1 Fault avoidance
3.1.4Trial Capacity on Demand
3.2.2 First Failure Data Capture
3.2.3 Permanent monitoring
Mutual surveillance
3.2.4Self-healing
Environmental monitoring
3.2.7Resource deallocation
3.2.6Fault masking
3.2.5 N+1 redundancy
Dynamic or persistent deallocation
3.2.8 Serviceability
Error indication and LED indicators
3.3.1 Advanced System Management Interface
Concurrent Maintenance
3.3Manageability
System Attention LED
3.3.2 Service Agent
3.3.4 Service Update Management Assistant
Service focal point
3.3.3 p5 Customer-ManagedMicrocode
3.4 Cluster
CSM value points
CSM V1.4 on AIX and Linux planned 4Q04
64p5-570Technical Overview and Introduction
Related publications
IBM Redbooks
Other publications
Online resources
66p5-570Technical Overview and Introduction
How to get IBM Redbooks
Help from IBM
68p5-570Technical Overview and Introduction
Page
Technical Overview
For more information: ibm.com/redbooks
IBM Eserver p5
and Introduction