Intel mPGA604 12

Assembled Component and Package Description

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12	mPGA604 Socket Design Guidelines

Contents

mPGA604 Socket Page Contents Figures Tables Revision History Re-ValidationNotice to Socket Vendors Page 1Introduction 1.1Objective 1.2Purpose 1.3Scope Page 2Assembled Component and Package Description 2.1Assembled Component Description 2.2Package Description Page 3Mechanical Requirements 3.1Mechanical Supports 3.2Materials 3.2.1Socket Housing 3.2.2Color 3.5Markings 3.5.1Name mPGA604 3.5.2Lock (Closed) and Unlock (Open) Markings 3.5.3Lot Traceability 3.6Socket Size 3.7Socket/Package Translation During Actuation 3.8Orientation in Packaging, Shipping and Handling 3.9Contact Characteristics 3.9.1Number of Contacts 3.10Material and Recycling Requirements 3.11Lever Actuation Requirements 3.12Socket Engagement/Disengagement Force 3.13Visual Aids 3.14Socket BGA Co-Planarity 3.16Critical-to-FunctionDimensions Page 4Electrical Requirements 4.1Electrical Resistance Page Page Page 4.2Determination of Maximum Electrical Resistance 4.3Inductance 4.3.1 Design Procedure for Inductance Measurements 4.3.2Correlation of Measurement and Model Data Inductance 4.4Pin-to-PinCapacitance 4.5Dielectric Withstand Voltage 4.6Insulation Resistance 4.7Contact Current Rating Page 5Environmental Requirements 5.1Porosity Test 5.1.1Porosity Test Method 5.1.2Porosity Test Criteria 5.2Plating Thickness 5.3Solvent Resistance 5.5Durability Page 6Validation Testing Requirements 6.1Applicable Documents 6.2Testing Facility 6.3Funding 6.4Socket Design Verification 6.7Quality Assurance Requirements 6.8Socket Test Plan 6.8.1Submission of an mPGA604 Socket for Validation Testing 6.9Mechanical Samples 6.10Socket Validation Notification 7Safety Requirements Page 8Documentation Requirements Page AAppendix A