Intel mPGA604 manual Contents

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Contents

1	Introduction .......................................................................................................................		9
	1.1	Objective ................................................................................................................	9
	1.2	Purpose..................................................................................................................	9
	1.3	Scope .....................................................................................................................	9

2	Assembled Component and Package Description......................................................			11
	2.1	Assembled Component Description.....................................................................		11
	2.2	Package Description ............................................................................................		11
3	Mechanical Requirements..............................................................................................			13
	3.1	Mechanical Supports ...........................................................................................		13
	3.2	Materials...............................................................................................................		13
		3.2.1	Socket Housing.......................................................................................	13
		3.2.2	Color........................................................................................................	13
	3.3	Cutouts for Package Removal .............................................................................		13
	3.4	Socket Standoff Height ........................................................................................		13
	3.5	Markings...............................................................................................................		14
		3.5.1	Name.......................................................................................................	14
		3.5.2 Lock (Closed) and Unlock (Open) Markings...........................................		14
		3.5.3	Lot Traceability........................................................................................	14
	3.6	Socket Size ..........................................................................................................		15
	3.7	Socket/Package Translation During Actuation ....................................................		15
	3.8	Orientation in Packaging, Shipping and Handling ...............................................		15
	3.9	Contact Characteristics........................................................................................		15
		3.9.1	Number of Contacts ................................................................................	15
		3.9.2	Base Material ..........................................................................................	15
		3.9.3	Contact Area Plating ...............................................................................	15
		3.9.4 Solder Ball Attachment Area Plating.......................................................		15
		3.9.5	Solder Ball Characteristics......................................................................	15
		3.9.6	Lubricants................................................................................................	16
	3.10	Material and Recycling Requirements .................................................................		16
	3.11	Lever Actuation Requirements.............................................................................		16
	3.12	Socket Engagement/Disengagement Force ........................................................		16
	3.13	Visual Aids ...........................................................................................................		16
	3.14	Socket BGA Co-Planarity.....................................................................................		16
	3.15	Solder Ball True Position .....................................................................................		16
	3.16	Critical-to-Function Dimensions ...........................................................................		17
4	Electrical Requirements .................................................................................................			19
	4.1	Electrical Resistance............................................................................................		20
	4.2	Determination of Maximum Electrical Resistance ...............................................		24
	4.3	Inductance............................................................................................................		24
		4.3.1 Design Procedure for Inductance Measurements ..................................		25
		4.3.2 Correlation of Measurement and Model Data Inductance ......................		26
	4.4	Pin-to-Pin Capacitance ........................................................................................		27
	4.5	Dielectric Withstand Voltage ................................................................................		27
	4.6	Insulation Resistance...........................................................................................		27
	4.7	Contact Current Rating ........................................................................................		27

mPGA604 Socket Design Guidelines 3