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1Introduction
1.1Objective
This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation and server platforms based on future Intel microprocessors. The socket provides I/O, power and ground contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with solder balls/surface mount features for surface mounting with the motherboard. The mPGA604 socket contacts have 50mil pitch with regular pin array, to mate with a
1.2Purpose
To define functional, quality, reliability, and material (that is, visual, dimensional and physical) requirements and design guidelines of the mPGA604 socket in order to provide low cost, low risk, robust, high volume manufacturable (HVM) socket solution available from multiple sources.
1.3Scope
This design guideline applies to all
mPGA604 Socket Design Guidelines | 9 |