Intel mPGA604 6.7Quality Assurance Requirements, 6.8Socket Test Plan, 6.9Mechanical Samples, 6.10Socket Validation Notification, 6.11Production Lot Definition

Validation Testing Requirements

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6.7Quality Assurance Requirements

The OEM’s will work with the socket supplier(s) they choose to ensure socket quality.

6.8Socket Test Plan

6.8.1Submission of an mPGA604 Socket for Validation Testing

The socket supplier's mPGA604 socket will be sent to Intel's independent test facility for socket validation testing. The sockets submitted must be per the drawing required in Section 6.4. Refer to Sections 6.11 and 6.12 for production lot definition and number of samples required for validation testing.

6.9Mechanical Samples

A mechanical sample of mPGA604 socket, package, and heatsink (or suitable mockups that approximate size and mass of the planned heatsink) will be used during the mated socket validation testing. The maximum mass for mPGA604 socket package heatsink is recommended as (but not limited to) 450g with the stipulation that the requirements of Section 3.1 be met. See data sheet and related documentation for further information on heatsinks, thermal solutions and mechanical support.

6.10Socket Validation Notification

Upon completion of the testing and receipt of test data, Intel and/or the Intel designated test facility will prepare a summary report for the socket supplier and Intel that will provide notification as to whether the socket has passed or failed socket validation testing.

6.11Production Lot Definition

A production lot is defined as a separate process run through the major operations including molding, contact stamping, contact plating and assembly. These lots should be produced on separate shifts or days of the week. Lot identification marking needs to be provided to Intel as verification of this process.

6.12Socket Validation

Socket validation must meet or exceed all guidelines called out in this spec which include: Visual Inspection, CTF Dimensional Verification, Electrical Resistance, Loop Inductance, Pin to Pin Capacitance, Contact Current Rating, Dielectric Withstand Voltage, Insulation, Durability, Porosity, Plating Thickness, Solvent Resistance (if applicable), Solderability (Applicable for leaded sockets), Post Reliability Visual and use conditions. The use conditions target failure rates are <1% at 7 years and <3% at 10 years. Statistical sample sizes, taken randomly from multiple lots, for each test is required.

34 mPGA604 Socket Design Guidelines