Validation Testing Requirements

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6.7Quality Assurance Requirements

The OEM’s will work with the socket supplier(s) they choose to ensure socket quality.

6.8Socket Test Plan

6.8.1Submission of an mPGA604 Socket for Validation Testing

The socket supplier's mPGA604 socket will be sent to Intel's independent test facility for socket validation testing. The sockets submitted must be per the drawing required in Section 6.4. Refer to Sections 6.11 and 6.12 for production lot definition and number of samples required for validation testing.

6.9Mechanical Samples

A mechanical sample of mPGA604 socket, package, and heatsink (or suitable mockups that approximate size and mass of the planned heatsink) will be used during the mated socket validation testing. The maximum mass for mPGA604 socket package heatsink is recommended as (but not limited to) 450g with the stipulation that the requirements of Section 3.1 be met. See data sheet and related documentation for further information on heatsinks, thermal solutions and mechanical support.

6.10Socket Validation Notification

Upon completion of the testing and receipt of test data, Intel and/or the Intel designated test facility will prepare a summary report for the socket supplier and Intel that will provide notification as to whether the socket has passed or failed socket validation testing.

6.11Production Lot Definition

A production lot is defined as a separate process run through the major operations including molding, contact stamping, contact plating and assembly. These lots should be produced on separate shifts or days of the week. Lot identification marking needs to be provided to Intel as verification of this process.

6.12Socket Validation

Socket validation must meet or exceed all guidelines called out in this spec which include: Visual Inspection, CTF Dimensional Verification, Electrical Resistance, Loop Inductance, Pin to Pin Capacitance, Contact Current Rating, Dielectric Withstand Voltage, Insulation, Durability, Porosity, Plating Thickness, Solvent Resistance (if applicable), Solderability (Applicable for leaded sockets), Post Reliability Visual and use conditions. The use conditions target failure rates are <1% at 7 years and <3% at 10 years. Statistical sample sizes, taken randomly from multiple lots, for each test is required.

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mPGA604 Socket Design Guidelines

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Intel mPGA604 manual Quality Assurance Requirements, Socket Test Plan, Mechanical Samples, Socket Validation Notification
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mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
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