R

3Mechanical Requirements

3.1Mechanical Supports

A retention system needs to isolate any load in excess of 50 lbf, compressive, from the socket during the shock and vibration conditions outlined in Sections 5. The socket must pass the mechanical shock and vibration requirements listed in Sections 5 with the associated heatsink and retention mechanism attached. socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw, extra solder, adhesive, etc.) methods to attach the socket are acceptable.

3.2Materials

3.2.1Socket Housing

Thermoplastic or equivalent, UL 94V-0 flame rating, temperature rating and design capable of withstanding a temperature of 240° C for 40sec (minimum) typical of a reflow profile for solder material used on the socket. The material must have a thermal coefficient of expansion in the XY plane capable of passing reliability tests rated for an expected high operating temperature, mounted on FR4-type motherboard material.

3.2.2Color

The color of the socket can be optimized to provide the contrast needed for OEM’s pick and place vision systems. The base and cover of the socket may be different colors as long as they meet the above requirement.

3.3Cutouts for Package Removal

Recessed cutouts are required in the side of the socket to provide better access to the package substrate, and facilitate the manual removal of inserted package. Figure A-6.

3.4Socket Standoff Height

Socket stand off height, cover lead in and cover lead in depth must not interfere with package pin shoulder at worst-case conditions. The processor (not the pin shoulder) must sit flush on the socket standoffs and the pin field cannot contact the standoffs. Figure A-5.

mPGA604 Socket Design Guidelines

13