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Mechanical Requirements

3.6Socket Size

The socket size must meet the dimensions as shown in Figure A-5and Figure A-6,allowing full insertion of the pins in the socket, without interference between the socket and the pin field. The mPGA604 socket and actuation area must fit within the keep-in zone defined in Figure A-6.

3.7Socket/Package Translation During Actuation

The socket shall be built so that the post-actuated package pin field displacement will not exceed

1.27 mm. Movement will be along the Y direction (refer to axes as indicated in Figure A-5.No Z- axis travel (lift out) of the package is allowed during actuation.

3.8Orientation in Packaging, Shipping and Handling

Packaging media needs to support high volume manufacturing.

3.9Contact Characteristics

3.9.1Number of Contacts

Total number of contacts: 603.

Total number of contact holes: 604.

3.9.2Base Material

High strength copper alloy.

3.9.3Contact Area Plating

0.762 ∝ m (min) gold plating over 1.27 ∝ m (min) nickel underplate in critical contact areas (area on socket contacts where processor pins will mate) is required. No contamination by solder in the contact area is allowed during solder reflow.

3.9.4Solder Ball Attachment Area Plating

3.81 ∝ m (min) Tin/Lead (typically 85± 5Sn/15Pb).

3.9.5Solder Ball Characteristics

Tin/Lead (63/37 ± 0.5% Sn).

mPGA604 Socket Design Guidelines

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