R
Mechanical Requirements
3.6Socket Size
The socket size must meet the dimensions as shown in Figure
3.7Socket/Package Translation During Actuation
The socket shall be built so that the
1.27 mm. Movement will be along the Y direction (refer to axes as indicated in Figure
3.8Orientation in Packaging, Shipping and Handling
Packaging media needs to support high volume manufacturing.
3.9Contact Characteristics
3.9.1Number of Contacts
Total number of contacts: 603.
Total number of contact holes: 604.
3.9.2Base Material
High strength copper alloy.
3.9.3Contact Area Plating
0.762 ∝ m (min) gold plating over 1.27 ∝ m (min) nickel underplate in critical contact areas (area on socket contacts where processor pins will mate) is required. No contamination by solder in the contact area is allowed during solder reflow.
3.9.4Solder Ball Attachment Area Plating
3.81 ∝ m (min) Tin/Lead (typically 85± 5Sn/15Pb).
3.9.5Solder Ball Characteristics
Tin/Lead (63/37 ± 0.5% Sn).
mPGA604 Socket Design Guidelines | 15 |