R
2Assembled Component and Package Description
Information provided in this section is to ensure dimensional compatibility of the mPGA604 socket with that of the
2.1Assembled Component Description
The assembled component may consist of a heatsink, EMI shield, clips, fan, retention mechanism (RM), and processor package. Specific details can be obtained from Thermal Design Guidelines, consult your Intel field representative to obtain this document.
2.2Package Description
The outline of the processor package that can be used with the mPGA604 socket is illustrated in Figure
The
The pin dimension details, base material, plating material and plating thickness are shown in Figure
Table
Dimension
Shoulder Diameter (Land Solder Fillet Shoulder Inclusion)
Pin Diameter
Shoulder Diameter Protrusion (Land Solder Fillet Shoulder
Inclusion)
Pin Length (Effective)*
Pin True Position (Pattern Relating and Feature Relating)*
Flatness of Processor*
Note: Pin length, pin true position and flatness tolerances are controlled by Geometric Dimensioning and Tolerancing (GD&T) controls.
mPGA604 Socket Design Guidelines | 11 |