Mechanical Requirements

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3.9.6Lubricants

For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are used elsewhere within the socket assembly, these lubricants must not be able to migrate to the socket contacts.

3.10Material and Recycling Requirements

Cadmium shall not be used in the painting or plating of the socket.

CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic component exceeding 25g must be recyclable as per the European Blue Angel recycling design guidelines.

3.11Lever Actuation Requirements

•Lever closed direction – right.

•Actuation direction called out in Figure A-5.

•135° lever travel max.

•Pivot point in the center of the actuation area on the top of the socket. Figure A-6.

3.12Socket Engagement/Disengagement Force

The force on the actuation lever arm must not exceed 44N to engage or disengage the package into the mPGA604 socket. Movement of the cover is limited to the plane parallel to the motherboard. The processor package must not be utilized in the actuation of the socket. Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces).

3.13Visual Aids

The socket top will have markings identifying Pin 1. This marking will be represented by a clearly visible triangular symbol. See Figure A-6.

3.14Socket BGA Co-Planarity

The co-planarity (profile) requirement for all solder balls on the underside of the socket is located in Figure A-5.

3.15Solder Ball True Position

The solder ball pattern has a true position requirement with respect to Datum A, B, and C (see Figure A-5).

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mPGA604 Socket Design Guidelines