Intel mPGA604 5.1Porosity Test, 5.2Plating Thickness, 5.3Solvent Resistance, 5.4Solderability, 5.1.1Porosity Test Method, 5.1.2Porosity Test Criteria

Environmental Requirements

Table 5-1. Use Conditions Environment (Continued)

Use Environment	Speculative Stress	7 Year Life	10 Year Life
Use Environment	Condition	Expectation	Expectation
	Condition	Expectation	Expectation

Fast, large gradient on/off to max	Power Cycle	7,500 cycles	11,000 cycles
operating temp. (power cycle or
internally heated including power save
features).

Shipping and Handling.	Mechanical Shock	3 drops / axis 6
	50g trapezoidal	axis
	profile; 170”/sec
	Velocity change; 11
	msec duration pulse

Shipping and Handling.	Random Vibration	10 min / axis, 3
	3.13 gRMS, random,	axis
	5 Hz - 20 Hz .01
	g2/Hz sloping up to
	.02 g2/Hz 20 Hz -
	500 Hz .02 g2/Hz

5.1Porosity Test

5.1.1Porosity Test Method

Use EIA 364, Test Procedure 53A, Nitric acid test. Porosity test to be performed for 20 contacts, randomly selected per socket, five sockets.

5.1.2Porosity Test Criteria

Maximum of two pores per set of 20 contacts, as measured per EIA 364, Test Procedure 60.

5.2Plating Thickness

Measure various plating thickness on contact surface per EIA 364, Test Procedure 48, Method C or Method A. Test to be performed using 20 randomly selected contacts per socket, five sockets. No plating thickness measured shall be less than the minimum plating thickness specified in Section 3.9.3.

5.3Solvent Resistance

Requirement: No damage to ink markings if applicable. EIA 364-11A.

5.4Solderability

(Applicable for leaded sockets) Requirement: 95% coverage per ball/surface mount feature. EIA 364, Test Procedure 52, Class 2, Category 3. Test to be performed on 20 randomly selected contacts per socket, five sockets.

30	mPGA604 Socket Design Guidelines