Electrical Requirements

4.Calibration – Cascade Calibration Substrates or equivalent.

5.Measurement objects – packages, sockets, motherboards.

Measurement Steps:

•Equipment Setup

Cables should be connected to the network analyzer and to the probes using the appropriate torque wrench to ensure consistent data collection every time the measurement is performed.

•Set VNA

Bandwidth = 30 0KHz – 3 GHz with 801 points.

Averaging Factor = 16.

•Perform Open/Short/Load calibration:

Calibration should be performed at the start of any measurement session.

Create Calibration Kit if necessary for 1st time.

Do not perform port extension after calibration.

•Check to ensure calibration successfully performed.

•Measure the inductance of configuration 4 of the package mounted on the socket, which is mounted to the motherboard fixture (Figure 4-5):

Call this Lsocket assembly .

R

Export data into MDS/ADS or (capture data at frequency specified in Item 6 of Table 4-1).

•Measure the inductance of configuration 4 of the package mounted on the socket, which is mounted to the motherboard fixture (Figure 4-5). Call this Lsandwich :

Measure 30 units.

The package for 30 units must be chosen from different lots. Use 5 different lots, 6 units from each lot.

Export data into MDS/ADS or (capture data at frequency specified in Item 6 of Table 4-1).

Calculate Lsandwich .

For each socket unit, calculate

Lsocket = Lsocket assembly − Lsandwich

It means Lsandwich will be subtracted from each Lsocket assembly and the result will be compared with spec value for each individual socket unit.

4.3.2Correlation of Measurement and Model Data Inductance

To correlate the measurement and model data for loop inductance, one unit of measured socket assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture) will be chosen for cross-sectioning. Both units will be modeled based on data from cross-sectioning using Ansoft 3D*. The sandwich inductance will be subtracted from socket assembly inductance for both measured and modeled data. This procedure results in loop inductance for socket pin + interposer pin. This final result can be compared with the loop inductance from the supplier model

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mPGA604 Socket Design Guidelines

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Intel mPGA604 manual Correlation of Measurement and Model Data Inductance, Measurement Steps
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mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
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