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6Validation Testing Requirements

This section of the document outlines the tests that must be successfully completed in order for the supplier's socket to pass the design guidelines validation. It provides the test plan and procedure required for validation.

6.1Applicable Documents

EIA-364-C.

Electrical Mechanical and Thermal Specification (EMTS)*

Thermal Design Guidelines Document*

Note: *For details on ordering this documentation, contact your Intel field sales representative.

6.2Testing Facility

Testing will be performed by Intel's designated test facility.

6.3Funding

Socket supplier will fund socket validation testing for their socket. Any additional testing that is required due to design modifications will also be at the expense of the supplier.

6.4Socket Design Verification

At the earliest possible date, a detailed drawing of the socket supplier's mPGA604 socket must be provided to Intel for review. This drawing should include all of the features called out in this design guideline (marking, pinout, cam location, date code location and explanation, etc.) as well as dimensional and board layout information. This drawing will be used to confirm compliance to this design guideline.

6.5Reporting

Test reports of the socket validation testing will be provided directly from the independent test facility to Intel. Intel will also be given access to contact the test facility directly to obtain socket validation status, explanation of test results and recommendations based on the test results.

6.6Process Changes

Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation. Intel will review the modification and establish the necessary re-validation procedure that the socket must pass. Any testing that is required MUST be completed before the change is implemented.

Typical examples of significant changes include, but are not limited to, the following: Plastic material changes including base material or color; contact changes including base material, plating material or thickness; and design modifications.

mPGA604 Socket Design Guidelines

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