the heater and begin the reflow cycle. Heating time should not be less than two minutes.

Once the RF PA reflows, raise the heat-focus head and wait approximately two minute for the part to cool. Remove the circuit board and inspect the solder joint between the slab and the ground plane. No cleaning should be necessary. Use the soldering iron and add solder to each of the RF PA leads and associated pads. Inspect the lead/ pad bond for opens and solder shorts.

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Image 72
Motorola HT 1000 service manual