Motorola HT 1000 Thin Small Outline Package Tsop Components, To Replace an Pbga compo- nent

C a u t i o n

To Replace an PBGA compo- nent,

Thin Small Outline Package (TSOP) Components

Removing and Replacing a TSOP Component:

The application of heat to the PBGA device,

!beginning at ambient air temperature and ending with the PBGA component lifting from

the circuit board, should take longer than 60 seconds. If the PBGA component lifts from the circuit board earlier than 60 seconds:

•check the temperature control setting on the rework station, and if OK

•lift the heat-focus head an additional 1/8” from nominal setting, and

•check the circuit board plating for possible damage.

the solder pads on the board must first be cleaned of all solder to ensure alignment of the new chip carrier. Prepare the site by using solder wick and a soldering iron to remove all solder from the solder pads on the circuit board. If a power desoldering tool is available, it can be used instead of the solder wick. Clean the solder pads with alcohol and a small brush. Dry and inspect. Ensure that all solder is removed.

Once the preparation is complete, place the circuit board back in the circuit board holder. Add solder paste flux in the trench of the flux block and spread it using a one-inch putty knife. Flux the PBGA component by placing it in the trench of the flux block. Once the flux is applied, place the PBGA component on the circuit board, making certain that it is oriented correctly on the board. Position the heat- focus head over the PBGA component and lower it to approximately 1/8”-1/4” (0.3cm-0.6cm) over the carrier. Using the same heat setting used to remove the PBGA component, turn on the heater and wait for the carrier to reflow (heating and reflow should take longer than 60 seconds).Watch the PBGA component reflow and note that when a proper reflow has taken place, the PBGA component will drop (usually one side, then the other). The end result is that both sides have reflowed, and the PBGA component is sitting parallel to the circuit board.

Once the carrier reflows, raise the heat-focus head and wait approximately one minute for the part to cool. Remove the circuit board and inspect the repair. No cleaning should be necessary.

will be done with the R-1319, using the same procedure used to remove and replace an PBGA component.

Place the circuit board in the circuit board holder. Select the proper heat focus head and attach it to the heater chimney. Position the TSOP component under the heat-focus head. Lower the vacuum tip and attach it to the component by turning on the vacuum pump. Lower the focus head until it is approximately 1/8”-1/4” (0.3cm-0.6cm) above the component. Turn on the heater and wait until the TSOP lifts off the circuit board.

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