Motorola I580 service manual Mechanical Parts Rework and Repair, Recommended Equipment

MECHANICAL PARTS REWORK AND REPAIR: Recommended Equipment

CHAPTER 9

MECHANICAL PARTS REWORK AND REPAIR

The following section details the equipment and procedures needed to correctly remove and replace specific Main Board components on the i580.

9.1Recommended Equipment

9.1.1Hot Air Machine

Pace ThermoFlo 200 or similar.

9.1.2Preheater

X-Kar 1000-S or similar.

9.1.3High Performance Soldering Station

Pace HeatWise 200 with thermal recovery system or similar.

1..6mm (0.06”) CHISEL (P/N1124-0019-P1) to fill lands (Big) during Land Preparation procedure.

2.0.40mm (0.016”) 1/64” 60° BEVEL (P/N1124-0011-P1) to fill/level lands (Big) during Land Preparation procedure.

3.10.80mm (.425”) BLADE (P/N1124-0501-P1) to wick off or level solder (BGAs) during Land Preparation procedure.

9.1.4Microscope

Leica Stereozoom 6 or similar.

9.1.5Magnifier Lamp

5-diopter magnifier lamp.

9.1.6Fume Absorber

Pace Arm-Evac 200 or similar.

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