Cypress CY7C64215 manual DC Programming Specifications

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CY7C64215

DC Programming Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only.

Table 17. DC Programming Specifications

Parameter

Description

Min

Typ

Max

Unit

Notes

IDDP

Supply Current During Programming or

15

30

mA

 

 

Verify

 

 

 

 

 

VILP

Input Low Voltage During Programming or

0.8

V

 

 

Verify

 

 

 

 

 

VIHP

Input High Voltage During Programming or

2.1

V

 

 

Verify

 

 

 

 

 

IILP

Input Current when Applying Vilp to P1[0]

0.2

mA

Driving internal pull-down resistor.

 

or P1[1] During Programming or Verify

 

 

 

 

 

IIHP

Input Current when Applying Vihp to P1[0]

1.5

mA

Driving internal pull-down resistor.

 

or P1[1] During Programming or Verify

 

 

 

 

 

VOLV

Output Low Voltage During Programming

Vss + 0.75

V

 

 

or Verify

 

 

 

 

 

VOHV

Output High Voltage During Programming

Vdd – 1.0

Vdd

V

 

 

or Verify

 

 

 

 

 

FlashENPB

Flash Endurance (per block)

50,000

Erase/write cycles per block.

Flash

Flash Endurance (total)[6]

1,800,000

Erase/write cycles.

ENT

 

 

 

 

 

 

FlashDR

Flash Data Retention

10

Years

 

Note

6.A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles).

For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.

Document 38-08036 Rev. *C

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Contents Features Block DiagramCypress Semiconductor Corporation 198 Champion Court San Jose, CA Document 38-08036 Rev. *C Revised December 08Applications EnCoRe III Functional OverviewEnCoRe III Core Digital SystemEnCoRe III Device Characteristics EnCoRe III Device CharacteristicsGetting Started Additional System ResourcesDevelopment Tools Development KitsPSoC Designer Software Subsystems Device EditorDesigning with User Modules Hardware ToolsDeviceEditor ApplicationEditorDebugger Generate ApplicationDocument Conventions Acronyms UsedUnits of Measure Numeric NamingPin Part Pinout Pin Part Pinout MLF CY7C64215 56-Pin enCoRe III DevicePin Part Pinout Ssop CY7C64215 28-Pin enCoRe III DeviceP07 Analog column mux input P05 Analog column mux input and column OutputRegister Conventions Description Register ReferenceRegister Mapping Tables Name Addr 0,Hex Access Register Map Bank 0 Table User SpaceRegister Map Bank 1 Table Configuration Space Name Addr Access HexElectrical Specifications Units of Measure Symbol Unit of MeasureAbsolute Maximum Ratings Parameter Description Min Typ Unit Operating TemperatureAbsolute Maximum Ratings DC General Purpose IO Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC Full-Speed USB Specifications DC Analog Output Buffer SpecificationsP24 DC Analog Reference SpecificationsSupply Voltage Rejection Ratio DC Analog enCoRe III Block Specifications Resistor Unit Value Continuous Time 12.2RefHi = P24 + P26 P24 = Vdd/2, P26 = P24 + P26 + P24 P26 P24 P26 +DC POR and LVD Specifications DC Programming Specifications AC Electrical Characteristics AC Chip-Level SpecificationsAC General Purpose IO Specifications AC Full-Speed USB SpecificationsAC Digital Block Specifications AC External Clock SpecificationsAC Analog Output Buffer Specifications MHz Power = Low Power = HighLarge Signal Bandwidth, 1Vpp, 3-dB BW, 100 pF Load KHz Power = Low Power = HighAC Programming Specifications AC I2C SpecificationsSDA Package Diagrams Packaging InformationThermal Impedance for the Package Typical θ JA Solder Reflow Peak TemperatureThermal Impedance Package Handling Ordering InformationParameter Description Min Typical Max Unit Ordering Code Flash Size Sram BytesSales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC Solutions