Cypress CY7C64215 manual Thermal Impedance, Solder Reflow Peak Temperature

CY7C64215

Figure 10. 28-Pin Shrunk Small Outline Package

51-85079-*C

Thermal Impedance

Table 27. Thermal Impedance for the Package

Package	Typical θJA *
56 Pin MLF	20 oC/W
28 Pin SSOP	96 oC/W
* TJ = TA + POWER x θJA

Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Table 28. Solder Reflow Peak Temperature

Package	Minimum Peak Temperature*	Maximum Peak Temperature
56 Pin MLF	240°C	260°C
28 Pin SSOP	240°C	260°C

*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220±5°C with Sn-Pb or 245±5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.

Document 38-08036 Rev. *C Page 28 of 30

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