Cypress CY7C64215 Package Handling, Ordering Information, Ordering Code Flash Size Sram Bytes

CY7C64215

Package Handling

Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may degrade device reliability.

Parameter		Description		Min			Typical	Max	Unit
TBAKETEMP	Bake Temperature						125	See package label	°C
TBAKETIME	Bake Time		See package label					72	hours
Ordering Information
Package		Ordering Code			Flash Size			SRAM (Bytes)
56-Pin MLF		CY7C64215-56LFXC				16K		1K
28-Pin SSOP		CY7C64215-28PVXC				16K		1K

Document 38-08036 Rev. *C Page 29 of 30

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