Cypress CY7C1163V18, CY7C1165V18 Capacitance, Thermal Resistance, AC Test Loads and Waveforms

CY7C1161V18, CY7C1176V18

CY7C1163V18, CY7C1165V18

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	Max	Unit
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	5	pF
		VDD = 1.8V
CCLK	Clock Input Capacitance		6	pF
		VDDQ = 1.5V
CO	Output Capacitance		7	pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	165 FBGA	Unit
			Package
ΘJA	Thermal Resistance	Test conditions follow standard test methods and	17.2	°C/W
	(junction to ambient)	procedures for measuring thermal impedance, in
		accordance with EIA/JESD51.
ΘJC	Thermal Resistance		4.15	°C/W
	(junction to case)

AC Test Loads and Waveforms

Figure 5. AC Test Loads and Waveforms

VREF = 0.75V

VREF	0.75V
OUTPUT	Z0 = 50Ω
Device
Under
Test

ZQ

RQ =

250Ω

(a)

RL = 50Ω

VREF = 0.75V

VREF		0.75V			R = 50Ω
OUTPUT							ALL INPUT PULSES[23]
						1.25V
Device					5 pF 0.25V			0.75V
Under	ZQ						Slew Rate = 2 V/ns
Test			RQ =
			250Ω
INCLUDING
JIG AND				(b)
SCOPE

Notes

23.Unless otherwise noted, test conditions are based upon signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads.

Document Number: 001-06582 Rev. *D Page 22 of 29

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