Cypress CY7C1243V18 manual Features, Configurations, Functional Description, Selection Guide

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CY7C1241V18, CY7C1256V18

CY7C1243V18, CY7C1245V18

36-Mbit QDR™-II+ SRAM 4-Word Burst Architecture (2.0 Cycle Read Latency)

Features

Separate independent read and write data ports

Supports concurrent transactions

300 MHz to 375 MHz clock for high bandwidth

4-Word Burst for reducing address bus frequency

Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 750 MHz) at 375 MHz

Read latency of 2.0 clock cycles

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Single multiplexed address input bus latches address inputs for both read and write ports

Separate Port Selects for depth expansion

Data valid pin (QVLD) to indicate valid data on the output

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency providing most current data

Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD[1]

HSTL inputs and variable drive HSTL output buffers

Available in 165-ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Configurations

With Read Cycle Latency of 2.0 cycles:

CY7C1241V18 – 4M x 8

CY7C1256V18 – 4M x 9

CY7C1243V18 – 2M x 18

CY7C1245V18 – 1M x 36

Functional Description

The CY7C1241V18, CY7C1256V18, CY7C1243V18, and CY7C1245V18 are 1.8V Synchronous Pipelined SRAMs, equipped with Quad Data Rate-II+ (QDR-II+) architecture. QDR-II+ architecture consists of two separate ports to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR-II+ architecture has separate data inputs and data outputs to completely eliminate the need to “turn around” the data bus required with common IO devices. Each port can be accessed through a common address bus. Read and write addresses are latched on alternate rising edges of the input (K) clock. Accesses to the QDR-II+ read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with four 8-bit words (CY7C1241V18), 9-bit words (CY7C1256V18), 18-bit words (CY7C1243V18), or 36-bit words (CY7C1245V18), that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input clocks (K and K), memory bandwidth is maximized while simpli- fying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with Port Selects for each port. Port selects enable each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Selection Guide

Description

375 MHz

333 MHz

300 MHz

Unit

Maximum Operating Frequency

375

333

300

MHz

 

 

 

 

 

Maximum Operating Current

1240

1120

1040

mA

 

 

 

 

 

Note

1.The QDR consortium specification for VDDQ is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting VDDQ = 1.4V to VDD.

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-06365 Rev. *D

 

Revised March 12, 2008

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1256V18 Logic Block Diagram CY7C1241V18Doff Logic Block Diagram CY7C1245V18 Logic Block Diagram CY7C1243V18CY7C1241V18 4M x Pin ConfigurationsCY7C1256V18 4M x NC/144MCY7C1245V18 1M x CY7C1243V18 2M xWPS BWS RPS Pin Name Pin Description Pin DefinitionsNegative Input Clock Input Power Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagWrite Operations Functional OverviewByte Write Operations Read OperationsDelay Lock Loop DLL Valid Data Indicator QvldDepth Expansion Programmable ImpedanceTruth Table Application ExampleSram #4 BUS MasterComments Write Cycle DescriptionsRemains unaltered During the data portion of a write sequenceInto the device Write cycle description table for CY7C1245V18 follows.2Written into the device. D 359 remains unaltered Into the device. D 80 and D 3518 remain unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode EXIT2-IR UPDATE-DR UPDATE-IR TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Controller Parameter Description Test Conditions Min Max UnitTAP Timing and Test Conditions16 TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in QDR-II+ SramPower Up Waveforms DLL ConstraintsDC Electrical Characteristics Electrical CharacteristicsAC Electrical Characteristics Maximum RatingsThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Test Conditions Max UnitCypress Consortium Description 375 MHz 333 MHz 300 MHz Unit Switching CharacteristicsParameter Min Max Set-up TimesNOP Read Write Switching WaveformsOrdering Information Ball Fine Pitch Ball Grid Array 15 x 17 x 1.4 mm Lead-Free Ball Fbga 15 x 17 x 1.40 mm Package DiagramNXR Document HistoryVKN/KKVTMP VKN/AESA