Cypress CY7C1256V18 manual TDO for Jtag, TCK Pin for Jtag, TDI Pin for Jtag, TMS Pin for Jtag

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CY7C1241V18, CY7C1256V18

 

 

 

 

 

 

 

CY7C1243V18, CY7C1245V18

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

 

 

 

Pin Name

IO

 

 

Pin Description

 

 

 

CQ

Echo Clock

Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the

 

 

 

 

 

 

 

input clock (K) of the QDR-II+. The timing for the echo clocks is shown in “Switching Character-

 

 

 

 

 

 

istics” on page 23.

 

 

 

 

 

Echo Clock

Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the

 

 

CQ

 

 

 

 

 

input clock (K) of the QDR-II+. The timing for the echo clocks is shown in “Switching Character-

 

 

 

 

 

 

istics” on page 23.

 

 

ZQ

Input

Output Impedance Matching Input. This input is used to tune the device outputs to the system

 

 

 

 

 

 

 

data bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a

 

 

 

 

 

 

resistor connected between ZQ and ground. Alternatively, this pin can be connected directly to

 

 

 

 

 

 

VDDQ, which enables the minimum impedance mode. This pin cannot be connected directly to

 

 

 

 

 

 

GND or left unconnected.

 

 

 

 

 

Input

DLL Turn Off, Active LOW. Connecting this pin to ground turns off the DLL inside the device.

 

 

DOFF

 

 

 

 

 

The timing in the DLL turned off operation is different from that listed in this data sheet. For

 

 

 

 

 

 

normal operation, this pin can be connected to a pull up through a 10 Kohm or less pull up

 

 

 

 

 

 

resistor. The device behaves in QDR-I mode when the DLL is turned off. In this mode, the device

 

 

 

 

 

 

can be operated at a frequency of up to 167 MHz with QDR-I timing.

 

 

TDO

Output

TDO for JTAG.

 

 

 

 

 

 

 

 

TCK

Input

TCK Pin for JTAG.

 

 

 

 

 

 

 

 

TDI

Input

TDI Pin for JTAG.

 

 

 

 

 

 

 

 

TMS

Input

TMS Pin for JTAG.

 

 

 

 

 

 

 

 

NC

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

NC/72M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

NC/144M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

NC/288M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

VREF

Input-

Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs,

 

 

 

 

 

 

Reference

and AC measurement points.

 

 

VDD

Power Supply

Power Supply Inputs to the Core of the Device.

 

 

 

VSS

Ground

Ground for the Device.

 

 

 

VDDQ

Power Supply

Power Supply Inputs for the Outputs of the Device.

 

 

Document Number: 001-06365 Rev. *D

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Contents Selection Guide FeaturesConfigurations Functional DescriptionLogic Block Diagram CY7C1256V18 Logic Block Diagram CY7C1241V18Doff Logic Block Diagram CY7C1245V18 Logic Block Diagram CY7C1243V18NC/144M Pin ConfigurationsCY7C1241V18 4M x CY7C1256V18 4M xCY7C1245V18 1M x CY7C1243V18 2M xWPS BWS RPS Pin Name Pin Description Pin DefinitionsNegative Input Clock Input TCK Pin for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device TDO for JtagRead Operations Functional OverviewWrite Operations Byte Write OperationsProgrammable Impedance Valid Data Indicator QvldDelay Lock Loop DLL Depth ExpansionBUS Master Application ExampleTruth Table Sram #4During the data portion of a write sequence Write Cycle DescriptionsComments Remains unalteredInto the device. D 80 and D 3518 remain unaltered Write cycle description table for CY7C1245V18 follows.2Into the device Written into the device. D 359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode EXIT2-IR UPDATE-DR UPDATE-IR TAP Controller State DiagramParameter Description Test Conditions Min Max Unit TAP Controller Block DiagramTAP Electrical Characteristics TAP ControllerTAP Timing and Test Conditions16 TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderDLL Constraints Power Up Sequence in QDR-II+ SramPower Up Sequence Power Up WaveformsMaximum Ratings Electrical CharacteristicsDC Electrical Characteristics AC Electrical CharacteristicsParameter Description Test Conditions Max Unit CapacitanceThermal Resistance AC Test Loads and WaveformsSet-up Times Switching CharacteristicsCypress Consortium Description 375 MHz 333 MHz 300 MHz Unit Parameter Min MaxNOP Read Write Switching WaveformsOrdering Information Ball Fine Pitch Ball Grid Array 15 x 17 x 1.4 mm Lead-Free Ball Fbga 15 x 17 x 1.40 mm Package DiagramVKN/AESA Document HistoryNXR VKN/KKVTMP