Cypress CY7C1245V18, CY7C1241V18 Capacitance, Thermal Resistance, AC Test Loads and Waveforms

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CY7C1241V18, CY7C1256V18

CY7C1243V18, CY7C1245V18

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

Max

Unit

CIN

Input Capacitance

TA = 25°C, f = 1 MHz,

5

pF

 

 

VDD = 1.8V

 

 

CCLK

Clock Input Capacitance

4

pF

 

 

VDDQ = 1.5V

 

 

CO

Output Capacitance

5

pF

 

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter

Description

Test Conditions

165 FBGA

Unit

Package

 

 

 

 

ΘJA

Thermal Resistance

Test conditions follow standard test methods and

16.25

°C/W

 

(Junction to Ambient)

procedures for measuring thermal impedance, per

 

 

 

 

EIA/JESD51.

 

 

ΘJC

Thermal Resistance

2.91

°C/W

 

 

(Junction to Case)

 

 

 

AC Test Loads and Waveforms

Figure 3. AC Test Loads and Waveforms

VREF = 0.75V

VREF

 

 

 

 

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

Z0 = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

Under

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

 

 

 

 

 

 

 

ZQ

RQ =

250Ω

(a)

RL = 50Ω

VREF = 0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VREF

 

 

 

 

 

 

0.75V

 

 

 

 

 

R = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ALL INPUT PULSES[22]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5 pF 0.25V

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Under

ZQ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Slew Rate = 2 V/ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

RQ =

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

250Ω

 

 

 

 

 

 

 

 

 

 

INCLUDING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JIG AND

 

 

 

 

 

 

(b)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCOPE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note

22.Unless otherwise noted, test conditions assume signal transition time of 2 V/ns, timing reference levels of 0.75V, VREF = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.

Document Number: 001-06365 Rev. *D

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Contents Functional Description FeaturesConfigurations Selection GuideLogic Block Diagram CY7C1256V18 Logic Block Diagram CY7C1241V18Doff Logic Block Diagram CY7C1243V18 Logic Block Diagram CY7C1245V18CY7C1256V18 4M x Pin ConfigurationsCY7C1241V18 4M x NC/144MCY7C1245V18 1M x CY7C1243V18 2M xWPS BWS RPS Pin Name Pin Description Pin DefinitionsNegative Input Clock Input TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device TCK Pin for JtagByte Write Operations Functional OverviewWrite Operations Read OperationsDepth Expansion Valid Data Indicator QvldDelay Lock Loop DLL Programmable ImpedanceSram #4 Application ExampleTruth Table BUS MasterRemains unaltered Write Cycle DescriptionsComments During the data portion of a write sequenceWritten into the device. D 359 remains unaltered Write cycle description table for CY7C1245V18 follows.2Into the device Into the device. D 80 and D 3518 remain unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram EXIT2-IR UPDATE-DR UPDATE-IRTAP Controller TAP Controller Block DiagramTAP Electrical Characteristics Parameter Description Test Conditions Min Max UnitTAP AC Switching Characteristics TAP Timing and Test Conditions16Instruction Codes Identification Register DefinitionsScan Register Sizes Register Name Bit SizeBoundary Scan Order Bit # Bump IDPower Up Waveforms Power Up Sequence in QDR-II+ SramPower Up Sequence DLL ConstraintsAC Electrical Characteristics Electrical CharacteristicsDC Electrical Characteristics Maximum RatingsAC Test Loads and Waveforms CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitParameter Min Max Switching CharacteristicsCypress Consortium Description 375 MHz 333 MHz 300 MHz Unit Set-up TimesSwitching Waveforms NOP Read WriteOrdering Information Ball Fine Pitch Ball Grid Array 15 x 17 x 1.4 mm Lead-Free Package Diagram Ball Fbga 15 x 17 x 1.40 mmVKN/KKVTMP Document HistoryNXR VKN/AESA