Cypress CY7C1475V25, CY7C1473V25 Capacitance, Thermal Resistance, AC Test Loads and Waveforms

CY7C1471V25

CY7C1473V25

CY7C1475V25

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max.	Max.	Max.
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 2.5V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CIO	Input-Output Capacitance		5	5	5	pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow	24.63	16.3	15.2	°C/W
	(Junction to Ambient)	standard test methods
		and procedures for
ΘJC	Thermal Resistance		2.28	2.1	1.7	°C/W
		measuring thermal
	(Junction to Case)	impedance, according to
		EIA/JESD51.

AC Test Loads and Waveforms

2.5V IO Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL = 50Ω

10%

90%

5 pF

GND

R = 1538Ω

≤ 1 ns

VL = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

1.8V IO Test Load

OUTPUT

1.8V

R = 14 KΩ

ALL INPUT PULSES

VDDQ

– 0.2

Z0

= 50Ω

OUTPUT

RL = 50Ω

0.2

10%

90%

5 pF

R = 14 KΩ

≤ 1 ns

VL = 0.9V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

90%

10%

≤ 1 ns

Document #: 38-05287 Rev. *I Page 22 of 32

[+] Feedback