Cypress CY7C1473V33, CY7C1475V33 manual Interleaved Burst Address Table Mode = Floating or VDD

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CY7C1471V33

CY7C1473V33

CY7C1475V33

The data written during the write operation is controlled by BWX signals. The CY7C1471V33, CY7C1473V33, and CY7C1475V33 provides Byte Write capability that is described in the “Truth Table for Read/Write” on page 12. The input WE with the selected BWX input selectively writes to only the desired bytes. Bytes not selected during a Byte Write operation remain unaltered. A synchronous self timed write mechanism has been provided to simplify the write operations. Byte write capability is included to greatly simplify read/modify/write sequences, which can be reduced to simple byte write operations.

Because the CY7C1471V33, CY7C1473V33, and CY7C1475V33 are common IO devices, data must not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data to the DQs and DQPX inputs. Doing so tri-states the output drivers. As a safety precaution, DQs and DQPX are automati- cally tri-stated during the data portion of a write cycle, regardless of the state of OE.

Burst Write Accesses

The CY7C1471V33, CY7C1473V33, and CY7C1475V33 have an on-chip burst counter that enables the user to supply a single address and conduct up to four write operations without reasserting the address inputs. ADV/LD must be driven LOW to load the initial address, as described in the Single Write Access section. When ADV/LD is driven HIGH on the subsequent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incre- mented. The correct BWX inputs must be driven in each cycle of the burst write to write the correct bytes of data.

Sleep Mode

The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected before entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW.

Interleaved Burst Address Table (MODE = Floating or VDD)

First

Second

Third

Fourth

Address

Address

Address

Address

A1: A0

A1: A0

A1: A0

A1: A0

00

01

10

11

 

 

 

 

01

00

11

10

 

 

 

 

10

11

00

01

 

 

 

 

11

10

01

00

 

 

 

 

Linear Burst Address Table (MODE = GND)

First

Second

Third

Fourth

Address

Address

Address

Address

A1: A0

A1: A0

A1: A0

A1: A0

00

01

10

11

 

 

 

 

01

10

11

00

 

 

 

 

10

11

00

01

 

 

 

 

11

00

01

10

 

 

 

 

ZZ Mode Electrical Characteristics

Parameter

Description

Test Conditions

Min

Max

Unit

IDDZZ

Sleep mode standby current

ZZ > VDD – 0.2V

 

120

mA

tZZS

Device operation to ZZ

ZZ > VDD – 0.2V

 

2tCYC

ns

tZZREC

ZZ recovery time

ZZ < 0.2V

2tCYC

 

ns

tZZI

ZZ active to sleep current

This parameter is sampled

 

2tCYC

ns

tRZZI

ZZ Inactive to exit sleep current

This parameter is sampled

0

 

ns

Document #: 38-05288 Rev. *J

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Contents Selection Guide FeaturesFunctional Description 133 MHz 117 MHz UnitLogic Block Diagram CY7C1471V33 2M x Logic Block Diagram CY7C1473V33 4M xLogic Block Diagram CY7C1475V33 1M x Pin Configurations Pin Tqfp Pinout CY7C1471V33CY7C1473V33 CY7C1473V33 4M x ADV/LD Pin Definitions Single Write Accesses Single Read AccessesBurst Read Accesses Functional OverviewLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Address Operation Truth TableUsed Function Truth Table for Read/WriteFunction BW b BW a TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Registers TAP Instruction SetTAP Timing BypassOutput Times TAP AC Switching CharacteristicsParameter Description Min Max Unit Clock Hold Times5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Parameter Description Test Conditions MinScan Register Sizes Identification Register DefinitionsIdentification Codes Boundary Scan Exit Order 4M x Boundary Scan Exit Order 2M xBit # Ball ID W10 Boundary Scan Exit Order 1M xP10 V10Operating Range Electrical CharacteristicsMaximum Ratings Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Setup Times Switching CharacteristicsDescription 133 MHz 117 MHz Unit Parameter Min Max Rite Switching WaveformsRead Stall AddressQA2 Stall NOPDON’T Care Ordering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Orig. of Change Description of Change Date Document HistoryVKN VKN/AESA