Cypress CY7C1475V33, CY7C1473V33 manual Identification Register Definitions, Scan Register Sizes

Page 18

 

 

 

 

 

 

CY7C1471V33

 

 

 

 

 

 

CY7C1473V33

 

 

 

 

 

 

CY7C1475V33

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Register Definitions

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Field

CY7C1471V33

CY7C1473V33

CY7C1475V33

Description

(2Mx36)

(4Mx18)

(1Mx72)

 

 

 

 

 

Revision Number (31:29)

000

000

000

Describes the version number

 

 

 

 

 

Device Depth (28:24)[13]

01011

01011

01011

Reserved for internal use

Architecture/Memory

001001

001001

001001

Defines memory type and architecture

Type(23:18)

 

 

 

 

 

Bus Width/Density(17:12)

100100

010100

110100

Defines width and density

 

 

 

 

 

Cypress JEDEC ID Code (11:1)

00000110100

00000110100

00000110100

Enables unique identification of SRAM

 

 

 

 

 

 

vendor

ID Register Presence Indicator (0)

1

1

1

Indicates the presence of an ID

 

 

 

 

 

 

register

Scan Register Sizes

Register Name

Bit Size (x36)

Bit Size (x18)

Bit Size (x72)

Instruction

3

3

3

 

 

 

 

Bypass

1

1

1

 

 

 

 

ID

32

32

32

 

 

 

 

Boundary Scan Order – 165FBGA

71

52

-

 

 

 

 

Boundary Scan Order – 209BGA

-

-

110

 

 

 

 

Identification Codes

Instruction

Code

Description

EXTEST

000

Captures IO ring contents. Places the boundary scan register between TDI and TDO.

 

 

Forces all SRAM outputs to High-Z state. This instruction is not 1149.1-compliant.

IDCODE

001

Loads the ID register with the vendor ID code and places the register between TDI and

 

 

TDO. This operation does not affect SRAM operations.

SAMPLE Z

010

Captures IO ring contents. Places the boundary scan register between TDI and TDO.

 

 

Forces all SRAM output drivers to a High-Z state.

RESERVED

011

Do Not Use: This instruction is reserved for future use.

 

 

 

SAMPLE/PRELOAD

100

Captures IO ring contents. Places the boundary scan register between TDI and TDO.

 

 

Does not affect SRAM operation. This instruction does not implement 1149.1 preload

 

 

function and is therefore not 1149.1 compliant.

RESERVED

101

Do Not Use: This instruction is reserved for future use.

 

 

 

RESERVED

110

Do Not Use: This instruction is reserved for future use.

 

 

 

BYPASS

111

Places the bypass register between TDI and TDO. This operation does not affect SRAM

 

 

operations.

Note

13. Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device.

Document #: 38-05288 Rev. *J

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Contents Selection Guide FeaturesFunctional Description 133 MHz 117 MHz UnitLogic Block Diagram CY7C1471V33 2M x Logic Block Diagram CY7C1473V33 4M xLogic Block Diagram CY7C1475V33 1M x Pin Configurations Pin Tqfp Pinout CY7C1471V33CY7C1473V33 CY7C1473V33 4M x ADV/LD Pin Definitions Single Write Accesses Single Read AccessesBurst Read Accesses Functional OverviewInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Truth Table Address OperationUsed Truth Table for Read/Write FunctionFunction BW b BW a TAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Registers TAP Instruction SetTAP Timing BypassOutput Times TAP AC Switching CharacteristicsParameter Description Min Max Unit Clock Hold Times5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Parameter Description Test Conditions MinIdentification Register Definitions Scan Register SizesIdentification Codes Boundary Scan Exit Order 2M x Boundary Scan Exit Order 4M xBit # Ball ID W10 Boundary Scan Exit Order 1M xP10 V10Operating Range Electrical CharacteristicsMaximum Ratings Range AmbientCapacitance Thermal ResistanceAC Test Loads and Waveforms Switching Characteristics Setup TimesDescription 133 MHz 117 MHz Unit Parameter Min Max Switching Waveforms RiteRead Stall AddressQA2 Stall NOPDON’T Care Ordering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Orig. of Change Description of Change Date Document HistoryVKN VKN/AESA