Cypress CY7C1475V33, CY7C1473V33 Functional Overview, Single Read Accesses, Burst Read Accesses

Page 9

 

 

 

 

CY7C1471V33

 

 

 

 

 

CY7C1473V33

 

 

 

 

 

CY7C1475V33

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

 

Name

IO

Description

 

 

 

 

 

TDO

JTAG serial

Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the

 

 

output

JTAG feature is not used, this pin must be left unconnected. This pin is not available on

 

 

Synchronous

TQFP packages.

 

 

 

 

 

TDI

JTAG serial input

Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature

 

 

Synchronous

is not used, this pin can be left floating or connected to VDD through a pull up resistor. This

 

 

 

 

 

pin is not available on TQFP packages.

 

TMS

JTAG serial input

Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature

 

 

Synchronous

is not used, this pin can be disconnected or connected to VDD. This pin is not available on

 

 

 

 

 

TQFP packages.

 

 

 

 

 

TCK

JTAG

Clock input to the JTAG circuitry. If the JTAG feature is not used, this pin must be

 

 

-Clock

connected to VSS. This pin is not available on TQFP packages.

 

NC

-

 

 

No Connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are address

 

 

 

 

 

expansion pins and are not internally connected to the die.

 

 

 

 

 

 

 

Functional Overview

The CY7C1471V33, CY7C1473V33, and CY7C1475V33 are synchronous flow through burst SRAMs designed specifically to eliminate wait states during write-read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recognized and all internal states are maintained. All synchronous operations are qualified with CEN. Maximum access delay from the clock rise (tCDV) is 6.5 ns (133-MHz device).

Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device is latched. The access can either be a read or write operation, depending on the status of the Write Enable (WE). Byte Write Select (BWX) can be used to conduct Byte Write operations.

Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (reads, writes, and deselects) are pipelined. ADV/LD must be driven LOW after the device is deselected to load a new address for the next operation.

Single Read Accesses

A read access is initiated when these conditions are satisfied at clock rise:

CEN is asserted LOW

CE1, CE2, and CE3 are ALL asserted active

WE is deasserted HIGH

ADV/LD is asserted LOW.

The address presented to the address inputs is latched into the Address Register and presented to the memory array and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to

the output buffers. The data is available within 6.5 ns (133-MHz device) provided OE is active LOW. After the first clock of the read access, the output buffers are controlled by OE and the internal control logic. OE must be driven LOW to drive out the requested data. On the subsequent clock, another operation (read/write/deselect) can be initiated. When the SRAM is deselected at clock rise by one of the chip enable signals, output is be tri-stated immediately.

Burst Read Accesses

The CY7C1471V33, CY7C1473V33 and CY7C1475V33 have an on-chip burst counter that enables the user to supply a single address and conduct up to four reads without reasserting the address inputs. ADV/LD must be driven LOW to load a new address into the SRAM, as described in the Single Read Access section. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an inter- leaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and wraps around when incremented sufficiently. A HIGH input on ADV/LD increments the internal burst counter regardless of the state of chip enable inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (read or write) is maintained throughout the burst sequence.

Single Write Accesses

Write accesses are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) WE is asserted LOW. The address presented to the address bus is loaded into the Address Register. The Write signals are latched into the Control Logic block. The data lines are automatically tri-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQs and DQPX.

On the next clock rise the data presented to DQs and DQPX (or a subset for Byte Write operations, see “Truth Table for Read/Write” on page 12 for details) inputs is latched into the device and the write is complete. Additional accesses (read/write/deselect) can be initiated on this cycle.

Document #: 38-05288 Rev. *J

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Contents Functional Description FeaturesSelection Guide 133 MHz 117 MHz UnitLogic Block Diagram CY7C1473V33 4M x Logic Block Diagram CY7C1471V33 2M xLogic Block Diagram CY7C1475V33 1M x CY7C1471V33 Pin Configurations Pin Tqfp PinoutCY7C1473V33 CY7C1473V33 4M x ADV/LD Pin Definitions Burst Read Accesses Single Read AccessesSingle Write Accesses Functional OverviewInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Truth Table Address OperationUsed Truth Table for Read/Write FunctionFunction BW b BW a TAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set TAP RegistersBypass TAP TimingParameter Description Min Max Unit Clock TAP AC Switching CharacteristicsOutput Times Hold Times3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Parameter Description Test Conditions MinIdentification Register Definitions Scan Register SizesIdentification Codes Boundary Scan Exit Order 2M x Boundary Scan Exit Order 4M xBit # Ball ID P10 Boundary Scan Exit Order 1M xW10 V10Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientCapacitance Thermal ResistanceAC Test Loads and Waveforms Switching Characteristics Setup TimesDescription 133 MHz 117 MHz Unit Parameter Min Max Switching Waveforms RiteRead QA2 AddressStall Stall NOPDON’T Care Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History Issue Orig. of Change Description of Change DateVKN/AESA VKN