Cypress CY7C1565V18 manual Features Configurations, Selection Guide, Functional Description

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CY7C1561V18, CY7C1576V18

CY7C1563V18, CY7C1565V18

72-Mbit QDR™-II+ SRAM 4-Word Burst

Architecture (2.5 Cycle Read Latency)

Features

Configurations

Separate independent read and write data ports

Supports concurrent transactions

400 MHz clock for high bandwidth

4-word burst for reducing address bus frequency

Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 800 MHz) at 400 MHz

Available in 2.5 clock cycle latency

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Data valid pin (QVLD) to indicate valid data on the output

Single multiplexed address input bus latches address inputs for both read and write ports

Separate port selects for depth expansion

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD [1]

HSTL inputs and variable drive HSTL output buffers

Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Selection Guide

With Read Cycle Latency of 2.5 cycles:

CY7C1561V18 – 8M x 8

CY7C1576V18 – 8M x 9

CY7C1563V18 – 4M x 18

CY7C1565V18 – 2M x 36

Functional Description

The CY7C1561V18, CY7C1576V18, CY7C1563V18, and CY7C1565V18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR-II+ architecture. Similar to QDR-II archi- tecture, QDR-II+ SRAMs consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR-II+ architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus that exists with common IO devices. Each port is accessed through a common address bus. Addresses for read and write addresses are latched on alternate rising edges of the input (K) clock. Accesses to the QDR-II+ read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with four 8-bit words (CY7C1561V18), 9-bit words (CY7C1576V18), 18-bit words (CY7C1563V18), or 36-bit words (CY7C1565V18) that burst sequentially into or out of the device. Because data is trans- ferred into and out of the device on every rising edge of both input clocks (K and K), memory bandwidth is maximized while simpli- fying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with port selects, which enables each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Description

 

400 MHz

375 MHz

333 MHz

300 MHz

Unit

Maximum Operating Frequency

 

400

375

333

300

MHz

 

 

 

 

 

 

 

Maximum Operating Current

x8

1400

1300

1200

1100

mA

 

 

 

 

 

 

 

 

x9

1400

1300

1200

1100

 

 

 

 

 

 

 

 

 

x18

1400

1300

1200

1100

 

 

 

 

 

 

 

 

 

x36

1400

1300

1200

1100

 

 

 

 

 

 

 

 

Note

1.The QDR consortium specification for VDDQ is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting VDDQ = 1.4V to VDD.

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-05384 Rev. *F

 

 

Revised March 6, 2008

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Contents Selection Guide Features ConfigurationsFunctional Description Description 400 MHz 375 MHz 333 MHz 300 MHz UnitLogic Block Diagram CY7C1576V18 Logic Block Diagram CY7C1561V18Doff Logic Block Diagram CY7C1565V18 Logic Block Diagram CY7C1563V18Ball Fbga 15 x 17 x 1.4 mm Pinout Pin ConfigurationCY7C1561V18 8M x CY7C1576V18 8M xWPS BWS CY7C1563V18 4M xCY7C1565V18 2M x Pin Name Pin Description Pin DefinitionsNegative Input Clock Input Power Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagRead Operations Functional OverviewWrite Operations Byte Write OperationsApplication Example Valid Data Indicator QvldDepth Expansion Programmable ImpedanceWrite Cycle Descriptions Truth TableOperation CommentsWrite cycle description table for CY7C1565V18 follows Write cycle description table for CY7C1576V18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in QDR-II+ SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings VDD Operating Supply VDD = Max 333 MHz Automatic Power down Max VDD 400 MHz300 MHz Current Both Ports DeselectedCapacitance AC Electrical CharacteristicsThermal Resistance Parameter Description Test Conditions Max UnitConsortium Description 400 MHz 375 MHz 333 MHz 300 MHz Unit Switching CharacteristicsParameter Min Max HighRead/Write/Deselect Sequence 31, 32 Switching WaveformsOrdering Information 333 Ball Fbga 15 x 17 x 1.4 mm Package DiagramDocument History