Cypress CY7C1565V18 Application Example, Depth Expansion, Programmable Impedance, Echo Clocks

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CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18

Depth Expansion

The CY7C1563V18 has a port select input for each port. This enables for easy depth expansion. Both port selects are sampled on the rising edge of the positive input clock only (K). Each port select input can deselect the specified port. Deselecting a port does not affect the other port. All pending transactions (read and write) are completed prior to the device being deselected.

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5X the value of the intended line impedance driven by the SRAM, the allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The output impedance is adjusted every 1024 cycles upon power up to account for drifts in supply voltage and temperature.

Echo Clocks

Echo clocks are provided on the QDR-II+ to simplify data capture on high-speed systems. Two echo clocks are generated by the QDR-II+. CQ is referenced with respect to K and CQ is refer- enced with respect to K. These are free-running clocks and are synchronized to the input clock of the QDR-II+. The timing for the echo clocks are shown in Switching Characteristics on page 23.

Valid Data Indicator (QVLD)

QVLD is provided on the QDR-II+ to simplify data capture on high speed systems. The QVLD is generated by the QDR-II+ device along with data output. This signal is also edge-aligned with the echo clock and follows the timing of any data pin. This signal is asserted half a cycle before valid data arrives.

DLL

These chips use a Delay Lock Loop (DLL) that is designed to function between 120 MHz and the specified maximum clock frequency. The DLL may be disabled by applying ground to the DOFF pin. When the DLL is turned off, the device behaves in QDR-I mode (with 1.0 cycle latency and a longer access time). For more information, refer to the application note, “DLL Consid- erations in QDRII/DDRII/QDRII+/DDRII+”. The DLL can also be reset by slowing or stopping the input clocks K and K for a minimum of 30ns. However, it is not necessary to reset the DLL to lock to the desired frequency. During Power up, when the DOFF is tied HIGH, the DLL is locked after 2048 cycles of stable clock.

Application Example

Figure 1 shows four QDR-II+ used in an application.

Figure 1. Application Example

 

 

 

SRAM #1

 

ZQ

RQ = 250ohms

 

 

ZQ

RQ = 250ohms

 

Vt

 

CQ/CQ

 

 

SRAM #4

CQ/CQ

 

 

 

D

 

 

Q

 

D

 

Q

 

 

R

A

RPS WPS BWS

K

K

 

A

RPS WPS BWS

K K

 

DATA IN

 

 

 

 

 

 

R

 

 

DATA OUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Vt

 

 

Address

 

 

 

 

 

 

Vt

 

 

BUS MASTER

RPS

 

 

 

 

 

 

R

 

 

 

 

 

 

 

 

 

 

 

(CPU or ASIC)

WPS

 

 

 

 

 

 

 

 

 

 

BWS

 

 

 

 

 

 

 

 

 

CLKIN/CLKIN

 

 

 

 

 

 

 

 

 

Source K

 

 

 

 

 

 

 

 

 

Source K

 

 

 

 

 

 

R = 50ohms, Vt = VDDQ/2

 

 

 

 

 

 

 

 

Document Number: 001-05384 Rev. *F

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Contents Selection Guide Features ConfigurationsFunctional Description Description 400 MHz 375 MHz 333 MHz 300 MHz UnitLogic Block Diagram CY7C1561V18 Logic Block Diagram CY7C1576V18Doff Logic Block Diagram CY7C1565V18 Logic Block Diagram CY7C1563V18Ball Fbga 15 x 17 x 1.4 mm Pinout Pin ConfigurationCY7C1561V18 8M x CY7C1576V18 8M xCY7C1563V18 4M x WPS BWSCY7C1565V18 2M x Pin Definitions Pin Name Pin DescriptionNegative Input Clock Input Power Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagRead Operations Functional OverviewWrite Operations Byte Write OperationsApplication Example Valid Data Indicator QvldDepth Expansion Programmable ImpedanceWrite Cycle Descriptions Truth TableOperation CommentsWrite cycle description table for CY7C1565V18 follows Write cycle description table for CY7C1576V18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence in QDR-II+ Sram Power Up SequenceDLL Constraints Electrical Characteristics DC Electrical CharacteristicsMaximum Ratings VDD Operating Supply VDD = Max 333 MHz Automatic Power down Max VDD 400 MHz300 MHz Current Both Ports DeselectedCapacitance AC Electrical CharacteristicsThermal Resistance Parameter Description Test Conditions Max UnitConsortium Description 400 MHz 375 MHz 333 MHz 300 MHz Unit Switching CharacteristicsParameter Min Max HighRead/Write/Deselect Sequence 31, 32 Switching WaveformsOrdering Information 333 Ball Fbga 15 x 17 x 1.4 mm Package DiagramDocument History